A reactive modifier that enhances the thermal mechanical properties of epoxy resin through the formation of multiple hydrogen-bonded network

Journal of Polymer Research

Volumn 18, Issue 5, 2011, Pages 1169-1176

  Juang, Tzong Yuan ^a   Liu, Jene Ku ^b   Chang, Chia Cheng ^b   Shau, Shi Min ^b   Tsai, Mei Hui ^c   Dai, Shenghong A ^b   Su, Wen Chiung ^d   Lin, Ching Hsuan ^b   Jeng, Ru Jong ^b  

^a NATIONAL CHIAYI UNIVERSITY   (Taiwan)

^b NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^c NATIONAL CHIN YI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^d CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Cross linked; Epoxy; Hydrogen bond; Reactive modifier; Thermosets

Indexed keywords

CROSS-LINKED; DIPHENYLMETHANE; EPOXY; EPOXY NETWORK; EPOXY SYSTEMS; FLAME RETARDANCY; HYDROGEN BOND DONORS; HYDROGEN BONDED NETWORK; INTERMOLECULAR INTERACTIONS; LIMITED OXYGEN INDEX; LOSS MODULI; NON-COVALENT INTERACTION; POLYMER NETWORKS; REACTIVE MODIFIER; THERMAL MECHANICAL PROPERTIES; THERMOSETTING BLENDS;

DYNAMIC ANALYSIS; DYNAMIC MECHANICAL ANALYSIS; FUNCTIONAL GROUPS; FUNCTIONAL POLYMERS; GLASS TRANSITION; HYDROGEN BONDS; MECHANICAL PROPERTIES; METHANE; RESINS; THERMOSETS;

EPOXY RESINS;

EID: 80053386674     PISSN: 10229760     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10965-010-9520-3     Document Type: Article

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