Effect of polymer molecular weight on the fiber morphology of electrospun mats

Journal of Colloid and Interface Science

Volumn 364, Issue 1, 2011, Pages 107-111

  Pant, Hem Raj ^a,b   Nam, Ki Taek ^a   Oh, Hyun Ju ^a   Panthi, Gopal ^a   Kim, Hee Dong ^c   Kim, Byung Il ^d   Kim, Hak Yong ^a  

^a Chonbuk National University   (South Korea)

^b TRIBHUVAN UNIVERSITY   (Nepal)

^c Korea Textile Development Institute   (South Korea)

^d Huvis Corporation   (South Korea)

Author keywords

Degradation; Electrospinning; Nylon 6; Spider net; Sub nanofibers

Indexed keywords

BET SURFACE AREA; ELECTROSPUNS; FIBER MORPHOLOGY; NYLON-6; POLYMER MOLECULAR WEIGHT; PORE DIAMETERS; SPIDER-NET; SUB-NANOFIBERS; ULTRAFINE;

DEGRADATION; ELECTROSPINNING; FORMIC ACID; MORPHOLOGY; NANOFIBERS; RAYON;

POLYAMIDES;

FORMIC ACID; NANOFIBER; NYLON; POLYMER; SOLVENT;

ARTICLE; DEGRADATION; ELECTROSPINNING; FIBER; FILTRATION; MOLECULAR WEIGHT; MORPHOLOGY; PRIORITY JOURNAL; STRENGTH;

CAPROLACTAM; FILTRATION; MICROSCOPY, ELECTRON, SCANNING; MOLECULAR WEIGHT; PARTICLE SIZE; POLYMERS; SURFACE PROPERTIES;

EID: 80053181038     PISSN: 00219797     EISSN: 10957103     Source Type: Journal    
DOI: 10.1016/j.jcis.2011.07.094     Document Type: Article

References (26)

1. Bhardwaj N., Kundu S.C. Biotechnol. Adv. 2003, 28:325.
2. Greiner A., Wendorff J.H. Angew. Chem. Int. Edit. 2007, 46:5670.
3. Shi W., Lu W., Jiang L. J. Colloid Interface Sci. 2009, 340:291.
4. Su C., Shao C., Liu Y. J. Colloid Interface Sci. 2011, 359:220.
5. Zhan S., Yang a J., Liu Y., Wang N., Dai J., Yu H., Gao X., Li Y. J. Colloid Interface Sci. 2011, 355:328.
6. Frenot A., Chronakis I.S. Curr. Opin. Colloid Interface Sci. 2003, 8:64.
7. Subbiah T., Bhat G.S., Tock R.W., Parameswaran S., Ramkumar S.S. J. Appl. Polymer Sci. 2005, 96:557.
8. Wang H.S., Fu G.D., Li X.S. Recent Patents Nanotechnol. 2009, 3:21.
9. Reneker D.H., Chun I. Nanotechnology 1996, 7:216.
10. Shui J.L., Li J.C.M. Nano Lett. 2009, 9:1307.
11. Li D., Xia Y.N. Adv. Mater. 2004, 16:1151.
12. Fong H., Chun I., Reneker D.H. Polymer 1999, 40:4585.
13. Shenoy S.L., Bates W.D., Frisch H.L., Wnek G.E. Polymer 2005, 46:3372.
14. McKee M.G., Wilkes G.L., Colby R.H., Long T.E. Macromolecules 2004, 37:1760.
15. Pant H.R., Bajgai M.P., Yi C., Nirmala R., Nam K.T., Baek W., Kim H.Y. Colloids Surf. A: Phys. Eng. Aspects 2010, 370:87.
16. Ding B., Chunrong L., Yasuhiro M., Kuwaki O., Shiratori S. Nanotechnology 2006, 17:3685.
17. Callegari G., Tyomkin I., Kornev K.G., Neimark A.V., Hsieh Y.L. J. Colloid Interface Sci. 2011, 353:290.
18. Parajuli D.C., Bajgai M.P., Ko J.A., Kang H.K., Khil M.S., Kim H.Y. Appl. Mater. Interfaces 2009, 1:750.
19. Barakat N.A.M., Kanjwal M.A., Sheikh F.A., Kim H.Y. Polymer 2009, 50:4389.
20. Pant H.R., Bajgai M.P., Nam K.T., Chu K.H., Park S.J., Kim H.Y. Mater. Lett. 2010, 64:2087.
21. Pant H.R., Bajgai M.P., Nam K.T., Seo Y.A., Pandeya D.R., Hong S.T., Kim H.Y. J. Hazard. Mater. 2011, 185:124.
22. Vasanthan N., Salem D.R. J. Polym. Sci: Part B 2001, 39:536.
23. John A.D. LANGE'S Handbook of Chemistry 2001, McGraw-Hill, New York. 15th ed.
24. Schaefgen J.R., Trivisonno C.F. J. Am. Chem. Soc. 1951, 73:4580.
25. Montaudo G., Montaudo M.S., Puglisi C., Samperi F. J. Polym. Sci.: Part A 1996, 34:439.
26. Zhang H., Li S., White C.J.B., Ning X., Nie H., Zhu L. Electrochim. Acta 2009, 54:5739.