ABS fabrics chemically plated by Cu/Ni-P as electromagnetic shielding material

Advanced Materials Research

Volumn 328-330, Issue , 2011, Pages 1086-1089

  Yu, Chengda ^a,b   Li, Ping ^a   Wang, Yongfeng ^a   Tang, Lei ^a,b  

^a BEIJING INSTITUTE OF TECHNOLOGY   (China)

^b BEIJING INSTITUTE OF SPECIAL ELECTROMECHANICAL TECHNOLOGY   (China)

Author keywords

ABS resin; Chemical plating; Cu Ni P; Electromagnetic shielding; Fabric

Indexed keywords

CHEMICAL PLATING; FABRIC COMPOSITES; HIGH-FREQUENCY RADIATION; PLATING TECHNIQUE; SHIELDING EFFECT; VARYING THICKNESS;

ABS RESINS; COMPOSITE MATERIALS; ELECTROMAGNETISM; FABRICS; IODINE; MAGNETIC MATERIALS; MECHATRONICS; RESINS; SHIELDING; STYRENE;

ELECTROMAGNETIC SHIELDING;

EID: 80053119757     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.328-330.1086     Document Type: Conference Paper

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