Application of copper electrochemical deposition for the metallization of micropores

Wuli Huaxue Xuebao/ Acta Physico - Chimica Sinica

Volumn 27, Issue 9, 2011, Pages 2135-2140

  Yang, Fang Zu ^a   Wu, Wei Gang ^a   Tian, Zhong Qun ^a   Zhou, Shao Min ^a  

^a XIAMEN UNIVERSITY   (China)

Author keywords

Copper electroplating; Electroless copper plating; Metallization; Micropore; Printed circuit board

Indexed keywords

EID: 80053054959     PISSN: 10006818     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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