Experimental research of electrochemical mechanical polishing(ECMP) for Micro tool electrode

Advanced Materials Research

Volumn 314-316, Issue , 2011, Pages 1846-1850

  Guo, Shuai ^a   Guo, Z N ^a   Luo, Hongping ^a   Gu, Wencai ^a  

^a GUANGDONG UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Compound machining; ECMP; Micro tool electrode; Surface quality

Indexed keywords

ECMP; ELECTRICAL PARAMETER; ELECTROCHEMICAL MECHANICAL POLISHING; EXPERIMENTAL RESEARCH; MACHINING GAP; MECHANICAL POLISHING; MICRO-TOOL; PROCESS PARAMETERS; SURFACE QUALITIES; WORK PIECES; WORKING FLUID;

DESIGN; INDUSTRIAL RESEARCH; MANUFACTURE; POLISHING;

ELECTROCHEMICAL ELECTRODES;

EID: 80052976670     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.314-316.1846     Document Type: Conference Paper

References (3)

1. Wencai Gu, Feng Li, Zhaoqin Yu, Xiaokang Liu. Development and software of three-dimensional electrochemical sophisticated polishing machine for micro-machining. Manufacturing technology & machine tool.2009(4):51-54.
2. Z.N Guo, Liu Guoyue, Liu Jiangwen. research of electrochemistry mechanical process based on the wire-combined tool. Institute of Electrical processing 2007, 2007, 92-97.
3. Zhigang Huang, Z.N Guo. finite element analysis on the temperature field of EDM pulse. Journal of Guangdong University of Technology, 2002, (19):38-43.