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Volumn 51, Issue 9-11, 2011, Pages 1919-1926
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Comparison of IGBT short-circuit failure "ohmic mode": Epoxy molded package versus silicone gel module for new fail-safe and interruptible power converters
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Author keywords
[No Author keywords available]
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Indexed keywords
ACTIVE REDUNDANCY;
CRITICAL ENERGY;
EXPLOSION ENERGY;
FAILSAFE;
LOW ENERGIES;
OHMIC MODES;
THERMAL CYCLING TEST;
TIME DURATION;
WIREBONDING;
GELS;
MELTING;
SILICONES;
WIRE;
ELECTRIC NETWORK ANALYSIS;
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EID: 80052948905
PISSN: 00262714
EISSN: None
Source Type: Journal
DOI: 10.1016/j.microrel.2011.07.031 Document Type: Conference Paper |
Times cited : (9)
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References (7)
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