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Volumn 51, Issue 9-11, 2011, Pages 1919-1926

Comparison of IGBT short-circuit failure "ohmic mode": Epoxy molded package versus silicone gel module for new fail-safe and interruptible power converters

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE REDUNDANCY; CRITICAL ENERGY; EXPLOSION ENERGY; FAILSAFE; LOW ENERGIES; OHMIC MODES; THERMAL CYCLING TEST; TIME DURATION; WIREBONDING;

EID: 80052948905     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.07.031     Document Type: Conference Paper
Times cited : (9)

References (7)
  • 2
    • 33750134605 scopus 로고    scopus 로고
    • Acid decapsulation of epoxy molded IC packages with copper wire bonds
    • DOI 10.1109/TEPM.2006.882499
    • S. Murali, and N. Srikanth Acid decapsulation of epoxy molded IC packages with copper wire bonds IEEE Trans Electron Packaging Manuf 29 3 2006 179 183 (Pubitemid 44592863)
    • (2006) IEEE Transactions on Electronics Packaging Manufacturing , vol.29 , Issue.3 , pp. 179-183
    • Murali, S.1    Srikanth, N.2
  • 5
    • 0036875561 scopus 로고    scopus 로고
    • Failures-tolerance and remedial strategies of a PWM multicell inverter
    • F. Richardeau, P. Baudesson, and T. Meynard Failures-tolerance and remedial strategies of a PWM multicell inverter IEEE Trans Power Electron 17 6 2002 905 912
    • (2002) IEEE Trans Power Electron , vol.17 , Issue.6 , pp. 905-912
    • Richardeau, F.1    Baudesson, P.2    Meynard, T.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.