Fighting fire with fire: Modeling the datacenter-scale effects of targeted superlattice thermal management

Proceedings - International Symposium on Computer Architecture

Volumn , Issue , 2011, Pages 331-340

  Biswas, Susmit ^a   Tiwari, Mohit ^b   Sherwood, Timothy ^b   Theogarajan, Luke ^b   Chong, Frederic T ^b  

^a LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

^b University of California   (United States)

Author keywords

Active cooling; Cooling power; Data center; TEC

Indexed keywords

ACTIVE COOLING; CHIP RELIABILITY; COOLING POWER; COOLING SOLUTIONS; DATA CENTERS; GLOBAL COOLING; HEAT DIFFUSIONS; HEAT SPREADERS; HIGHER TEMPERATURES; HOT SPOT; HOTSPOTS; IT POWER; LEAKAGE POWER; MULTI SCALE ANALYSIS; MUTUAL INTERACTION; ON CHIPS; POTENTIAL POWER; POWER MANAGEMENTS; POWER MODEL; PROCESSOR RELIABILITY; TEC; THERMOELECTRIC COOLER; WORST CASE;

COMPUTER ARCHITECTURE; COOLING; ENERGY MANAGEMENT; METEOROLOGY; PELTIER EFFECT; SUPERLATTICES; THERMOELECTRIC EQUIPMENT; THERMOELECTRIC REFRIGERATION; COOLING SYSTEMS;

COOLING SYSTEMS; COOLING;

EID: 80052534475     PISSN: 10636897     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/2000064.2000104     Document Type: Conference Paper

References (36)

1. Comp turns up the heat on energy conservation. https://newsline.llnl.gov/ firev02/articles/2009/oct/10.02.09-energy.php.
2. The International Technology Roadmap for Semiconductors. http://www.itrs.net/.
3. A. Bar-Cohen and P. Wang. On-Chip Thermal Management and Hot-Spot Remediation. In Nano-Bio-Electronic, Photonic and MEMS Packaging, pages 349-429. Springer Science+Business Media, LLC, 2010.
4. L. A. Barroso and U. Hölzle. The Case for Energy-Proportional Computing. IEEE Computer, 40(12):33-37, Dec. 2007.
5. C. Bash and G. Forman. Cool Job Allocation: Measuring the Power Savings of Placing Jobs at Cooling-efficient Locations in the Data Center. In ATC'07: 2007 USENIX Annual Technical Conference, pages 1-6. USENIX Association.
6. C. Bash, C. Patel, and R. Sharma. Dynamic Thermal Management of Air Cooled Data Centers. In The Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06, pages 445-452.
7. J. Black. Electromigration-A Brief Survey and Some Recent Results. IEEE Transactions on Electron Devices, 16(4):338-347, 1969.
8. D. Brooks, V. Tiwari, and M. Martonosi. Wattch: A Framework for Architectural-level Power Analysis and Optimizations. In Proceedings of the 27th annual International Symposium on Computer Architecture, pages 83-94, New York, NY, USA, 2000. ACM.
9. P. Chaparro, J. Gonzalez, and A. Gonzalez. Thermal-aware Clustered Microarchitectures. In IEEE International Conference on Computer Design: VLSI in Computers and Processors (ICCD 2004), pages 48-53, October 2004.
10. C. Chen, C. Wu, and C. Hwang. Optimal Design and Control of CPU Heat Sink Processes. IEEE Transactions on Components and Packaging Technologies, 31(1):184, 2008.
11. I. Chowdhury, R. Prasher, K. Lofgreen, G. Chrysler, S. Narasimhan, R. Mahajan, D. Koester, R. Alley, and R. Venkatasubramanian. On-chip Cooling by Superlattice-based Thin-film Thermoelectrics. Nature Nanotechnology, 4(4):235-238, 2009.
12. G. Chrysler. Building Blocks for Thermal Management of Electronics. Next-Generation Thermal Management Materials and Systems, 2002.
13. S. Chung and K. Skadron. Using On-Chip Event Counters For High-Resolution, Real-Time Temperature Measurement. In The Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems, 2006 (ITHERM'06), pages 114-120.
14. D. Garday and D. Costello. Air-Cooled High-Performance Data Centers: Case Studies and Best Methods. Technology@Intel Magazine, http: //www.intel.com/it/ pdf/air-cooled-data-centers.pdf.
15. S. Heo, K. Barr, and K. Asanović. Reducing Power Density Through Activity Migration. In ISLPED '03: Proceedings of the 2003 International Symposium on Low Power Electronics and Design, pages 217-222, New York, NY, USA, 2003. ACM.
16. M. Huang, J. Renau, S. Yoo, and J. Torrellas. The Design of DEETM: a Framework for Dynamic Energy Efficiency and Temperature Management. Journal of Instruction-Level Parallelism, 3:1-31, 2002.
17. M. Kimura. Field and Temperature Acceleration Model for Time-Dependent Dielectric Breakdown. IEEE Transactions on Electron Devices, 46(1):220-229, 2002.
18. M. Lane, E. Liniger, and J. Lloyd. Relationship Between Interfacial Adhesion and Electromigration in Cu Metallization. Journal of Applied Physics, 93:1417, 2003.
19. P. Li, L. Pileggi, M. Asheghi, and R. Chandra. Efficient Full-chip Thermal Modeling and Analysis. In Proceedings of the 2004 IEEE/ACM International Conference on Computer-aided Design, pages 326-331. IEEE Computer Society.
20. P. Mathew, S. Greenberg, S. Ganguly, D. Sartor, and W. Tschudi. How Does Your Data Center Measure Up? Energy Efficiency Metrics and Benchmarks for Data Center Infrastructure Systems. Technical Report LBNL-1960E, Lawrence Berkeley National Laboratory, Berkeley, CA, April 2009.
21. M. Monchiero, R. Canal, and A. Gonzalez. Power/Performance/Thermal Design-Space Exploration for Multicore Architectures. IEEE Transactions on Parallel and Distributed Systems, 19(5):666-681, May 2008.
22. J. Moore, J. Chase, P. Ranganathan, and R. Sharma. Making Scheduling "Cool": Temperature-Aware Workload Placement in Data Centers. In ATEC'05: Proceedings of the 2005 USENIX Annual Technical Conference, pages 61-75, Berkeley, CA, USA. USENIX Association.
23. C. Patel, R. Sharma, C. Bash, and A. Beitelmal. Thermal Considerations in Cooling Large Scale High Compute Density Data Centers. In The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM 2002), pages 767-776, 2002.
24. J. Pflueger and A. Esser. The Energy Smart Data Center. in Dell Power Solutions, http://www.dell.com/downloads/global/power/ps1q08-20080179- CoverStory.pdf, February 2008.
25. K. Puttaswamy and G. Loh. Thermal Herding: Microarchitecture Techniques for Controlling Hotspots in High-performance 3d-Integrated Processors. In International Symposium on High-Performance Computer Architecture, pages 193-204, 2007.
26. N. Rasmussen. Electrical Efficiency Modeling of Data Centers. APC. White paper, 2006.
27. E. Rotem, J. Hermerding, A. Cohen, and H. Cain. Temperature measurement in the Intel (R) CoreTM Duo Processor. Arxiv preprint arXiv:0709.1861, 2007.
28. R. R. Schmidt, E. E. Cruz, and M. K. Iyengar. Challenges of Data Center Thermal Management. IBM Journal of Research and Development, 49(4/5):709-723, 2005.
29. R. K. Sharma, C. E. Bash, C. D. Patel, R. J. Friedrich, and J. S. Chase. Balance of Power: Dynamic Thermal Management for Internet Data Centers. IEEE Internet Computing, 9(1):42-49, 2005.
30. R. K. Sharma, C. E. Bash, and R. D. Patel. Dimensionless Parameters For Evaluation Of Thermal Design And Performance Of Large-Scale Data Centers. In 8th ASME/AIAA Joint Thermophysics and Heat Transfer Conference, 2002.
31. K. Skadron, M. Stan, K. Sankaranarayanan, W. Huang, S. Velusamy, and D. Tarjan. Temperature-aware Microarchitecture: Modeling and Implementation. ACM Transactions on Architecture and Code Optimization (TACO), 1(1):94-125, 2004.
32. J. Srinivasan, S. V. Adve, P. Bose, and J. A. Rivers. The Case for Lifetime Reliability-Aware Microprocessors. In ISCA '04: Proceedings of the 31st Annual International Symposium on Computer Architecture, pages 276-287.
33. M. R. Stan, K. Skadron, M. Barcella, W. Huang, K. Sankaranarayanan, and S. Velusamy. HotSpot: a Dynamic Compact Thermal Model at the Processor-Architecture Level. Microelectronics Journal, 34:1153-1165, 2003.
34. 3 Superlattices. Japanese Journal of Applied Physics, 43(12):8325-8330, 2004.
35. S. Velusamy, W. Huang, J. Lach, M. Stan, and K. Skadron. Monitoring temperature in FPGA based SoCs. In ICCD 2005, pages 634-637, October 2005.
36. Y. Zhang, J. Christofferson, A. Shakouri, G. Zeng, J. Bowers, and E. Croke. On-Chip High Speed Localized Cooling Using Superlattice Micro-Refrigerators. IEEE Transactions on Components and Packaging Technologies, 29(2):395, 2006.