Impact of ambient atmosphere on plasma-damaged porous low-k characterization

2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, IITC/MAM 2011

Volumn , Issue , 2011, Pages

  Darnon, M ^a   Chevolleau, T ^a   David, T ^a,b   Posseme, N ^b   Bouyssou, R ^c   Hurand, R ^a,b,c   Joubert, O ^a   Licitra, C ^b   Rochat, N ^b   Bailly, F ^c   Verove, C ^c  

^a CEA GRENOBLE   (France)

^b CEA LETI   (France)

^c STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT ATMOSPHERE; PLASMA SPECIES; POROUS LOW-K;

METALLIZING; PLASMAS;

CHARACTERIZATION;

EID: 80052057376     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2011.5940348     Document Type: Conference Paper

References (6)

1. N. Posseme, T. Chevolleau, T. David, M. Darnon, O. Louveau, O. Joubert, J. Vac. Sci. Technol. B 25 (6), 2007
2. N. Posseme et al. J. Vac. Sci. Technol. B, in press
3. M. Baklanov, K.P. Mogilnikov, Microelectron. Eng. 64 (1), 2002
4. C. Licitra et al., submitted to ECS Transactions
5. R.K. Iler, The chemistry of silica, (Wiley, N.Y., 1979)
6. N. Rochat, M. Olivier, A. Chabli, F. Conne, G. Lefeuvre, C. Boll-Burdet, Appl. Phys. Lett. 77 (14), 2000