Cu damascene interconnects with an organic low-k fluorocarbon dielectric deposited by microwave excited plasma enhanced CVD

2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, IITC/MAM 2011

Volumn , Issue , 2011, Pages

  Gu, X ^a   Nemoto, T ^a,b   Tomita, Y ^a   Shirotori, A ^a   Duyos Mateo, R ^a   Miyatani, K ^b   Saito, A ^b   Kobayashi, Y ^b   Teramoto, A ^a   Kuroki, S ^a   Nozawa, T ^b   Matsuoka, T ^b   Sugawa, S ^a   Ohmi, T ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b TOKYO ELECTRON LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BLANKET FILMS; CU DAMASCENE; CU DAMASCENE INTERCONNECTS; DAMASCENE PROCESS; DRY ETCH PROCESS; EFFECTIVE DIELECTRIC CONSTANTS; ELECTRICAL CHARACTERISTIC; FLUOROCARBON FILMS; LOW K DIELECTRICS; NITROGEN PLASMA TREATMENT; ORGANIC LOW-K; STRESS TEST;

DIELECTRIC MATERIALS; DRY ETCHING; METALLIZING; NITROGEN PLASMA; PLASMA APPLICATIONS;

COPPER;

EID: 80052039432     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2011.5940345     Document Type: Conference Paper

References (8)

1. International technology roadmap for semiconductors (ITRS2009)
2. P.M. Ajayan, B.Q. Wei, R.Vajtai, "Reliability and current carrying capacity of carbon nanotubes" Applied Physics Letters, 2001
3. R. Saito, A. Jorio, M.S. Dresselhaus, G.Dresselhaus, "Raman spectroscopy of carbon nanotubes" Physics Reports 2002
4. O.L. Krivanek, C.C. Ahn, "A reference guide of electron energy loss spectroscopy spectra covering all stable elements
5. A.Z. Mosfegh, O. Akhavan "A calculation of diffusion parameters for Cu/Ta and Ta/Si interfaces in Cu/Ta/Si (111) structure" Materials Science in Semiconductor Processing, 2003
6. M. Hecker, D.Fischer, V. Hoffmann, H.-J. Engelmann, A. Voss, N. Mattern, C. Wenzel, C- Vogt, E. Zschech, "Influence of N content on microstructure and thermal stability of Ta-N thin films for Cu interconnection" Thin Solid Films, 2002
7. T. Oku, E. Kawakami, M. Uekubo, K. Takahiro, S. Yamaguchi, M. Murakami, "Diffusion property of TaN between Si and Cu", Applied Surface Science, 1996
8. J. Garcia-Céspedes, S. Thomasson, K.B.K. Teo, I.A. Kinloch, W.I. Milne, E. Pascual, E. Bertran, "Efficient diffusion barrier layers for the catalytic growth of carbon nanotubes on copper substrates" Carbon, 2009