Curing and thermal behavior of resin matrix for composites based on epoxidized soybean oil/diglycidyl ether of bisphenol A

Composites Part B: Engineering

Volumn 42, Issue 7, 2011, Pages 1803-1812

  Mustata, Fanica ^a   Tudorachi, Nita ^a   Rosu, Dan ^a  

^a PETRU PONI INSTITUTE OF MACROMOLECULAR CHEMISTRY   (Romania)

Author keywords

A. Thermosetting resin; B. Thermal properties; D. Thermal analysis; E. Cure

Indexed keywords

BISPHENOL A; CURING KINETICS; CURING REACTIONS; DIGLYCIDYL ETHER OF BISPHENOL-A; E. CURE; EPOXIDIZED SOYBEAN OIL; NEAR INFRARED; P-AMINOBENZOIC ACID; RESIN MATRIX; STATISTICAL DISTRIBUTION; THERMAL BEHAVIORS;

ACTIVATION ENERGY; AMINO ACIDS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ETHERS; GLASS TRANSITION; INFRARED DEVICES; PHENOLS; RESINS; SCANNING ELECTRON MICROSCOPY; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THERMOGRAVIMETRIC ANALYSIS; THERMOSETS;

EPOXY RESINS;

EID: 80051792728     PISSN: 13598368     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesb.2011.07.003     Document Type: Article

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