-
1
-
-
80051684215
-
-
Commercial switch-mode DC-DC converters datasheets. Discrete: Analog Device ADP2121 (2009), Fairchild Semiconductor FAN5361 (2008), Texas Instruments TS62601 (2008). Co-packaged IC/L: Enpirion EP5368QI (rev. F 2010), Micrel MIC3385 (2010), 2011
-
Commercial switch-mode DC-DC converters datasheets. Discrete: Analog Device ADP2121 (2009), Fairchild Semiconductor FAN5361 (2008), Texas Instruments TS62601 (2008). Co-packaged IC/L: Enpirion EP5368QI (rev. F 2010), Micrel MIC3385 (2010), 2011.
-
-
-
-
2
-
-
34547298717
-
A 65 MHz switching rate, two-stage interleaved synchronous buck converter with fully integrated output filter
-
May 21-24
-
S. Abedinpour, B. Bakkaloglu, and S. Kiaei, "A 65 MHz switching rate, two-stage interleaved synchronous buck converter with fully integrated output filter," in Proc. IEEE Int. Symp. Circuits Syst. (ISCAS), May 21-24, 2006, p. 4.
-
(2006)
Proc. IEEE Int. Symp. Circuits Syst. (ISCAS)
, pp. 4
-
-
Abedinpour, S.1
Bakkaloglu, B.2
Kiaei, S.3
-
3
-
-
52349111938
-
An inductive down converter system-in-package for integrated power management in battery-powered applications
-
H. J. Bergveld, R. Karadi, and K. Nowak, "An inductive down converter system-in-package for integrated power management in battery-powered applications," in Proc. IEEE Power Electron. Spec. Conf. (PESC), 2008, pp. 3335-3341.
-
(2008)
Proc. IEEE Power Electron. Spec. Conf. (PESC)
, pp. 3335-3341
-
-
Bergveld, H.J.1
Karadi, R.2
Nowak, K.3
-
4
-
-
44449085777
-
A class of ceramic-based chip inductors for hybrid integration in power supplies
-
DOI 10.1109/TPEL.2008.921180
-
M. H. Lim, J. D. van Wyk, F. C. Lee, and K. D. T. Ngo, "A class of ceramic-based chip inductors for hybrid integration in power supplies," IEEE Trans. Power Electron., vol. 23, no. 3, pp. 1556-1564, May 2008. (Pubitemid 351756728)
-
(2008)
IEEE Transactions on Power Electronics
, vol.23
, Issue.3
, pp. 1556-1564
-
-
Lim, M.H.1
Van Wyk, J.D.2
Lee, F.C.3
Ngo, K.D.T.4
-
5
-
-
80051687025
-
Switching electrical power supply utilizing miniature inductors integrally in a PCB
-
Nov. 11
-
E. Rodriguez and A. Estrov, "Switching electrical power supply utilizing miniature inductors integrally in a PCB," U.S. Patent 4 622 627, Nov. 11, 1986, pp. 622-627..
-
(1986)
U.S. Patent 4 622 627
, pp. 622-627
-
-
Rodriguez, E.1
Estrov, A.2
-
6
-
-
0033737207
-
Newgeneration integral passives: Materials, processes, and integration of resistors and capacitors on PWB substrates
-
S.K. Bhattacharya and R. R. Tummala, "Newgeneration integral passives: Materials, processes, and integration of resistors and capacitors on PWB substrates," J. Mater. Sci.: Mater. Electron., vol. 11, pp. 253-268, 2000.
-
(2000)
J. Mater. Sci.: Mater. Electron.
, vol.11
, pp. 253-268
-
-
Bhattacharya, S.K.1
Tummala, R.R.2
-
7
-
-
10944269431
-
A chip-level process for power switching module integration and packaging
-
Conference Record of the 2004 IEEE Industry Applications Conference; 39th IAS Annual Meeting
-
Z. Liang, J. D. van Wyk, and F. C. Lee, "A chip-level process for power switching module integration and packaging," in Proc. 39th IEEE Ind. Appl. Conf. IAS, 2004, pp. 1932-1939. (Pubitemid 40016551)
-
(2004)
Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)
, vol.3
, pp. 1932-1939
-
-
Liang, Z.1
Van Wyk, J.D.2
Lee, F.C.3
-
9
-
-
0030104766
-
Design of microfabricated transformers and inductors for high-frequency power conversion
-
PII S0885899396019369
-
C. R. Sullivan and S. R. Sanders, "Design of microfabricated transformers and inductors for high-frequency power conversion," IEEE Trans. Power Electron., vol. 11, no. 2, pp. 228-238, Mar. 1996. (Pubitemid 126774076)
-
(1996)
IEEE Transactions on Power Electronics
, vol.11
, Issue.2
, pp. 228-238
-
-
Sullivan, C.R.1
Sanders, S.R.2
-
10
-
-
0032294311
-
Micromachined planar inductors on silicon wafers for MEMS applications
-
Dec.
-
C. H. Ahn and M. G. Allen, "Micromachined planar inductors on silicon wafers for MEMS applications," IEEE Trans. Ind. Electron., vol. 45, no. 6, pp. 866-877, Dec. 1998.
-
(1998)
IEEE Trans. Ind. Electron.
, vol.45
, Issue.6
, pp. 866-877
-
-
Ahn, C.H.1
Allen, M.G.2
-
11
-
-
0036446060
-
Micro fabricated power inductors on silicon
-
J. M. Boggetto, Y. Lembeye, J. P. Ferrieux, and Y. Avenas, "Micro fabricated power inductors on silicon," in Proc. IEEE 33rd Annu. Power Electron. Spec. Conf. (PESC), 2002, pp. 1225-1229. (Pubitemid 35411219)
-
(2002)
PESC Record - IEEE Annual Power Electronics Specialists Conference
, vol.3
, pp. 1225-1229
-
-
Boggetto, J.M.1
Lembeye, Y.2
Ferrieux, J.P.3
Avenas, Y.4
-
12
-
-
76949095891
-
Thin-film-integrated power inductor on Si and its performance in an 8-MHz buck converter
-
Nov.
-
N. Wang, T. O'Donnell, R. Meere, F. M. F. Rhen, S. Roy, and S. C. O'Mathuna, "Thin-film-integrated power inductor on Si and its performance in an 8-MHz buck converter," IEEE Trans. Magn., vol. 44, no. 11, pp. 4096-4099, Nov. 2008.
-
(2008)
IEEE Trans. Magn.
, vol.44
, Issue.11
, pp. 4096-4099
-
-
Wang, N.1
O'Donnell, T.2
Meere, R.3
Rhen, F.M.F.4
Roy, S.5
O'Mathuna, S.C.6
-
13
-
-
36349009414
-
Soft magnetic properties of obliquely deposited Co-Zr-Ofilms
-
Dec.
-
Y. Sun, C. R. Sullivan,W. Li, D. Kopp, F. Johnson, and S. T. Taylor, "Soft magnetic properties of obliquely deposited Co-Zr-Ofilms," IEEE Trans. Magn., vol. 43, no. 12, pp. 4060-4064, Dec. 2007.
-
(2007)
IEEE Trans. Magn.
, vol.43
, Issue.12
, pp. 4060-4064
-
-
Sun, Y.1
Li, C.R.SullivanW.2
Kopp, D.3
Johnson, F.4
Taylor, S.T.5
-
14
-
-
74049092716
-
Integrating magnetic for on-chip power: Challenges and opportunities
-
San Jose, CA, Sep. 13-16
-
C. R. Sullivan, "Integrating magnetic for on-chip power: Challenges and opportunities," in Proc. IEEE 2009 Custom Integr. Circuits Conf. (CICC), San Jose, CA, Sep. 13-16, 2009, pp. 291-298.
-
(2009)
Proc. IEEE 2009 Custom Integr. Circuits Conf. (CICC)
, pp. 291-298
-
-
Sullivan, C.R.1
-
15
-
-
0035768613
-
High-density, low-loss MOS capacitors for integrated RF decoupling
-
F. Roozeboom, R. J. G. Elfrink, Th. G. S. M. Rijks, J. F. C. M. Verhoeven, A. Kemmeren, and J. E. A. M. Van Den Meerakker, "High-density, low-loss MOS capacitors for integrated RF decoupling," Int. Symp. Microelectron., vol. 4587, pp. 477-483, 2001. (Pubitemid 35188637)
-
(2001)
Proceedings of SPIE - The International Society for Optical Engineering
, vol.4587
, pp. 477-483
-
-
Roozeboom, F.1
Elfrink, R.J.G.2
Rijks, Th.G.S.M.3
Verhoeven, J.F.C.M.4
Kemmeren, A.5
Van Den Meerakker, J.E.A.M.6
-
16
-
-
0030120399
-
A novel capacitor technology based on porous silicon
-
V. Lehmann,W.Hönlein,H.Reisinger, A. Spitzer,H.Wendt, and J.Willer, "A novel capacitor technology based on porous silicon," Thin Solid Films J., vol. 276, pp. 138-142, 1996. (Pubitemid 126368346)
-
(1996)
Thin Solid Films
, vol.276
, Issue.1-2
, pp. 138-142
-
-
Lehmann, V.1
Honlein, W.2
Reisinger, H.3
Spitzer, A.4
Wendt, H.5
Willer, J.6
-
17
-
-
0033713575
-
Materials options for dielectrics in integrated capacitors
-
R. Ulrich and L. Schaper, "Materials options for dielectrics in integrated capacitors," Int. Symp. Adv. Packag. Mater., pp. 38-43, 2000.
-
(2000)
Int. Symp. Adv. Packag. Mater.
, pp. 38-43
-
-
Ulrich, R.1
Schaper, L.2
-
18
-
-
33751306761
-
5 MIM capacitor following 3D damascene architecture compatible with copper interconnects
-
DOI 10.1016/j.mee.2006.09.027, PII S0167931706004990
-
5 MIM capacitor following 3D damascene architecture compatible with copper interconnects," Microelectron. Eng. J., vol. 83, no. 11-12, pp. 2163-2168, 2006. (Pubitemid 44803174)
-
(2006)
Microelectronic Engineering
, vol.83
, Issue.11-12
, pp. 2163-2168
-
-
Thomas, M.1
Farcy, A.2
Gaillard, N.3
Perrot, C.4
Gros-Jean, M.5
Matko, I.6
Cordeau, M.7
Saikaly, W.8
Proust, M.9
Caubet, P.10
Deloffre, E.11
Cremer, S.12
Bruyere, S.13
Chenevier, B.14
Torres, J.15
-
19
-
-
32044439144
-
Atomic layer deposition of ultrathin metal-oxide films for nano-scale device applications
-
H. Kim and P. C. McIntyre, "Atomic layer deposition of ultrathin metaloxide films for nano-scale device applications," J. Korean Phys. Soc., vol. 48, no. 1, pp. 5-17, Jan. 2006. (Pubitemid 43198819)
-
(2006)
Journal of the Korean Physical Society
, vol.48
, Issue.1
, pp. 5-17
-
-
Kim, H.1
McIntyre, P.C.2
-
20
-
-
67649989282
-
2 thin films deposited by MOCVD for high-density 3D capacitors
-
2 thin films deposited by MOCVD for high-density 3D capacitors," J. Microelectron. Eng., vol. 86, no. 10, pp. 2034-2037, 2009.
-
(2009)
J. Microelectron. Eng.
, vol.86
, Issue.10
, pp. 2034-2037
-
-
Brunet, M.1
Scheid, E.2
Galicka-Fau, K.3
Andrieux, M.4
Legros, C.5
Gallet, I.6
Herbst, M.7
Schamm, S.8
-
21
-
-
56749124569
-
Above IC integrated SrTiO3 high kMIM capacitors
-
E. Defaÿ, D.Wolozan, P. Garrec, B. Andre, L. Ulmer, M. Aïd, J.-P. Blanc, E. Serret, P. Delpech, J-C. Giraudin, J. Guillan, D. Pellissier, and P. Ancey, "Above IC integrated SrTiO3 high kMIM capacitors," in Proc. IEEE Eur. Solid-State Device Res. Conf. (ESSDERC), 2006, pp. 186-189.
-
(2006)
Proc. IEEE Eur. Solid-State Device Res. Conf. (ESSDERC)
, pp. 186-189
-
-
Defaÿ, E.1
Wolozan, D.2
Garrec, P.3
Andre, B.4
Ulmer, L.5
Aïd, M.6
Blanc, J.-P.7
Serret, E.8
Delpech, P.9
Giraudin, J.-C.10
Guillan, J.11
Pellissier, D.12
Ancey, P.13
-
22
-
-
70450255002
-
Composition influence on the physical and electrical properties of Srx Ti1-xOy -based metal-insulator-metal capacitors prepared by atomic layer deposition using TiN bottom electrodes
-
N. Menou, M. Popovici, S. Clima, K. Opsomer, W. Polspoel, B. Kaczer, G. Rampelberg, K. Tomida, M. A. Pawlak, C. Detavernier, D. Pierreux, J. Swerts, J.W. Maes,D.Manger, M. Badylevitch,V.Afanasiev, T.Conard, P. Favia, H. Bender, B. Brijs,W. Vandervorst, S. Van Elshocht, G. Pourois, D. J.Wouters, S. Biesemans, and J.A.Kittl, "Composition influence on the physical and electrical properties of Srx Ti1-xOy -based metal-insulator-metal capacitors prepared by atomic layer deposition using TiN bottom electrodes," J. Appl. Phys., vol. 106, no. 9, pp. 094101-1-094101-7, 2009.
-
(2009)
J. Appl. Phys.
, vol.106
, Issue.9
, pp. 0941011-0941017
-
-
Menou, N.1
Popovici, M.2
Clima, S.3
Opsomer, K.4
Polspoel, W.5
Kaczer, B.6
Rampelberg, G.7
Tomida, K.8
Pawlak, M.A.9
Detavernier, C.10
Pierreux, D.11
Swerts, J.12
Maes, J.W.13
Manger, D.14
Badylevitch, M.15
Afanasiev, V.16
Conard, T.17
Favia, P.18
Bender, H.19
Vandervorst, B.20
Brijs, W.21
Van Elshocht, S.22
Pourois, G.23
Wouters, D.J.24
Biesemans, S.25
Kittl, J.A.26
more..
-
23
-
-
77249087655
-
3 nanocrystals superparaelectric limit
-
3 nanocrystals superparaelectric limit," Adv. Funct. Mater., vol. 20, pp. 554-560, 2010.
-
Adv. Funct. Mater.
, vol.20
, Issue.2010
, pp. 554-560
-
-
Huang, L.1
Jia, Z.2
Kymissis, I.3
O'Brien, S.4
-
24
-
-
44649116349
-
Fabrication of perovskite-based high-value integrated capacitors by chemical solution deposition
-
J. Sigman, G. L. Brennecka, P. G. Clem, and B. A. Tuttle, "Fabrication of perovskite-based high-value integrated capacitors by chemical solution deposition," J. Amer. Ceramic Soc., vol. 91, no. 6, pp. 1851-1857, 2008.
-
(2008)
J. Amer. Ceramic Soc.
, vol.91
, Issue.6
, pp. 1851-1857
-
-
Sigman, J.1
Brennecka, G.L.2
Clem, P.G.3
Tuttle, B.A.4
-
25
-
-
70049102325
-
Analysis ofmicroinductor performance in a 20-100 MHz DC/DCConverter
-
Sep.
-
R. Meere, T. O'Donnell, H. J. Bergveld, Ningning Wang, and S. C. O'Mathuna, "Analysis ofmicroinductor performance in a 20-100 MHz DC/DCConverter," IEEE Trans. Power Electron., vol. 24, no. 9, pp. 2212-2218, Sep. 2009.
-
(2009)
IEEE Trans. Power Electron.
, vol.24
, Issue.9
, pp. 2212-2218
-
-
Meere, R.1
O'Donnell, T.2
Bergveld, H.J.3
Ningning Wang4
O'Mathuna, S.C.5
-
26
-
-
33646023709
-
Development of fabrication techniques for high-density integrated MIM capacitors in power conversion equipment
-
Jan.
-
M. Brunet, P. Dubreuil, E. Scheid, and J.-L. Sanchez, "Development of fabrication techniques for high-density integrated MIM capacitors in power conversion equipment," in Proc. SPIE MOEMS-MEMS Symp. Photon. West, Jan. 2006.
-
(2006)
Proc. SPIE MOEMS-MEMS Symp. Photon. West
-
-
Brunet, M.1
Dubreuil, P.2
Scheid, E.3
Sanchez, J.-L.4
-
27
-
-
80051685439
-
-
Ph.D. dissertation Inst. Nat. des Sci. Appliquées, Départment de Génie Electrique et Informatique, Toulouse, France Nov. 27
-
Ph. Artillan, "Design, modeling and realization of integrated inductive components for low power supplies and microsystems," Ph.D. dissertation, Inst. Nat. des Sci. Appliquées, Départment de Génie Electrique et Informatique, Toulouse, France, Nov. 27, 2008, p. 133.
-
(2008)
Design, Modeling and Realization of Integrated Inductive Components for Low Power Supplies and Microsystems
, pp. 133
-
-
Artillan, Ph.1
-
28
-
-
41149151719
-
Micro-inductors integrated on silicon for DC-DC converters
-
presented at , San Jose, CA
-
T. El Mastouli, J.-P. Laur, J.-L. Sanchez, M. Brunet, d. Bourrier, and M. Dilhan, "Micro-inductors integrated on silicon for DC-DC converters," presented at the SPIE, MEMS, and MOEMS, San Jose, CA, 2008, vol. 6882.
-
(2008)
The SPIE MEMS, and MOEMS
, vol.6882
-
-
El Mastouli, T.1
Laur, J.-P.2
Sanchez, J.-L.3
Brunet, M.4
Bourrier, D.5
Dilhan, M.6
-
29
-
-
77949957907
-
New self-controlled and self-protected IGBT based integrated switch
-
Barcelona, Spain Jun.
-
F. Capy, J.-P. Laur, M. Breil, F. Richardeau, M. Brunet, C. Caramel, P. Autin, and J.-L. Sanchez, "New self-controlled and self-protected IGBT based integrated switch," in Proc. IEEE Int. Symp. Power Semicond. Devices IC's, Barcelona, Spain, Jun.2009, pp. 243-246.
-
(2009)
Proc. IEEE Int. Symp. Power Semicond. Devices IC's
, pp. 243-246
-
-
Capy, F.1
Laur, J.-P.2
Breil, M.3
Richardeau, F.4
Brunet, M.5
Caramel, C.6
Autin, P.7
Sanchez, J.-L.8
-
31
-
-
68949151811
-
Factorial experimental design applied to DRIE for optimised process in power electronics applications requiring high-aspect ratio trenches
-
M. Brunet, P. Dubreuil, H. Mahfoz-Kotb, A. Gouantes, and A.-M. Dorthe, "Factorial experimental design applied to DRIE for optimised process in power electronics applications requiring high-aspect ratio trenches," Microsyst. Technol., vol. 15, p. 1449, 2009.
-
(2009)
Microsyst. Technol.
, vol.15
, pp. 1449
-
-
Brunet, M.1
Dubreuil, P.2
Mahfoz-Kotb, H.3
Gouantes, A.4
Dorthe, A.-M.5
-
32
-
-
80051689436
-
Profile enhancement of high aspect ratio silicon pores made by DRIE with TMAH + IPA bath
-
presented at, Guimares, Portugal
-
M. Brunet, M. Dilhan, D. Bourrier, H. M. Kotb, A. Benazzi, P. Dubreuil, and E. Scheid, "Profile enhancement of high aspect ratio silicon pores made by DRIE with TMAH + IPA bath," presented at the Proceedings of MicroMechanics Europe Workshop (MME), Guimares, Portugal, 2007.
-
(2007)
The Proceedings of MicroMechanics Europe Workshop (MME)
-
-
Brunet, M.1
Dilhan, M.2
Bourrier, D.3
Kotb, H.M.4
Benazzi, A.5
Dubreuil, P.6
Scheid, E.7
-
33
-
-
80051691076
-
Semiconductor device with high frequency parallel plate trench capacitor structure
-
G. M. Grivna, I. S. Wan, and S. C. Shastri, "Semiconductor device with high frequency parallel plate trench capacitor structure," U.S. Patent 6 984 860, 2006..
-
(2006)
U.S. Patent 6 984 860
-
-
Grivna, G.M.1
Wan, I.S.2
Shastri, S.C.3
-
34
-
-
47249153275
-
Ultrahigh capacitance density for multiple ALD-grown MIM capacitor stacks in 3-D silicon
-
Jul.
-
J. H. Klootwijk, K. B. Jinesh, W. Dekkers, J. F. Verhoeven, F. C. Van Den Heuvel, H.-D. Kim, D. Blin, M. A. Verheijen, R. G. R. Weemaes, M. Kaiser, J. J. M. Ruigrok, and F. Roozeboom, "Ultrahigh capacitance density for multiple ALD-grown MIM capacitor stacks in 3-D silicon," IEEE Electron Dev. Lett., vol. 29, no. 7, pp. 740-742, Jul. 2008.
-
(2008)
IEEE Electron Dev. Lett.
, vol.29
, Issue.7
, pp. 740-742
-
-
Klootwijk, J.H.1
Jinesh, K.B.2
Dekkers, W.3
Verhoeven, J.F.4
Van Den Heuvel, F.C.5
Kim, H.-D.6
Blin, D.7
Verheijen, M.A.8
Weemaes, R.G.R.9
Kaiser, M.10
Ruigrok, J.J.M.11
Roozeboom, F.12
|