Well encapsulated hollow borosilicate glass sphere@polypyrrole composite with low density, designable thickness and conductivity

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Volumn 386, Issue 1-3, 2011, Pages 158-165

  Xie, Xuan ^a   Zhou, Xiaodong ^a  

^a EAST CHINA UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Adhesion; Electrical conductivity; Encapsulate; Polypyrrole

Indexed keywords

CONDUCTING POLYMERS; ELECTRIC CONDUCTIVITY; ORGANIC CONDUCTORS; POLYMERIZATION; POLYPYRROLES; SCANNING ELECTRON MICROSCOPY; SPECTROSCOPY; SPHERES; THERMOGRAVIMETRIC ANALYSIS; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

AMINO GROUP; BUFFER SYSTEM; CAPSULATION; CONCENTRATION GRADIENTS; CONDUCTING MATERIALS; CORE-SHELL; ELECTRICAL CONDUCTIVITY; ENCAPSULATE; ENVIRONMENTAL STABILITY; FORMATION MECHANISM; FOUR-POINT PROBE METHOD; FOURIER; HOLLOW STRUCTURE; INFRARED SPECTRUM; LOW DENSITY; POLYMERIZATION PROCESS; POLYPYRROLE COMPOSITES; SCANNING ELECTRON MICROSCOPES;

BOROSILICATE GLASS;

AMINE; BORON DERIVATIVE; GLASS; POLYPYRROLE; SILICATE;

ADHESION; ARTICLE; COMPOSITE MATERIAL; ELECTRIC CONDUCTIVITY; ENCAPSULATION; FOURIER TRANSFORM MASS SPECTROMETRY; INFRARED SPECTROSCOPY; MORPHOLOGY; POLYMERIZATION; PRIORITY JOURNAL; SCANNING ELECTRON MICROSCOPE; THERMOGRAVIMETRY; THICKNESS; X RAY DIFFRACTION;

EID: 80051566607     PISSN: 09277757     EISSN: 18734359     Source Type: Journal    
DOI: 10.1016/j.colsurfa.2011.07.015     Document Type: Article

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