SCOPUS 정보 검색 플랫폼

Thin Solid Films

Volumn 519, Issue 20, 2011, Pages 6639-6644

Characteristics and applications of plasma enhanced-atomic layer deposition

(1) Kim, Hyungjun a

a Yonsei University (South Korea)

Author keywords

Atomic layer deposition; Device fabrication; Plasma deposition; Thin film deposition

Indexed keywords

ATOMIC LEVELS; CONFORMALITY; DEPOSITION TECHNIQUE; DEVICE FABRICATIONS; EMERGING APPLICATIONS; FILM PROPERTIES; LAYER DEPOSITION; NANOSCALE MANUFACTURING; PLASMA EXPOSURE; SEMI-CONDUCTOR FABRICATION; THERMAL ALD; THIN FILM DEPOSITION; VERSATILE METHODS;

ATOMIC LAYER DEPOSITION; ATOMS; FABRICATION; PLASMA DEPOSITION; PLASMAS;

DEPOSITION;

EID: 80051544932 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/j.tsf.2011.01.404 Document Type: Conference Paper

Times cited : (82)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.