Effect of surface stresses on CuO nanowire growth in the thermal oxidation of copper

Chemical Physics Letters

Volumn 512, Issue 1-3, 2011, Pages 87-91

  Mema, Rediola ^a   Yuan, Lu ^a   Du, Qingtian ^b   Wang, Yiqian ^b   Zhou, Guangwen ^a  

^a State University of New York at Binghamton   (United States)

^b QINGDAO UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRESS; CU IONS; FINE GRAIN STRUCTURE; GROWTH DENSITY; IN-PLANE; METAL SURFACES; NANOWIRE GROWTH; OUTWARD DIFFUSION; OXIDE GRAINS; OXIDE LAYER; SURFACE STRESS; THERMAL OXIDATION;

GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; NANOWIRES; OXIDATION; TENSILE STRESS;

GRAIN GROWTH;

EID: 80051473283     PISSN: 00092614     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cplett.2011.07.012     Document Type: Article

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