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Volumn 110, Issue 2, 2011, Pages

Lattice thermal conductivity of the Cu3SbSe4-Cu 3SbS4 solid solution

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC MASS; COMPOSITIONAL DEPENDENCE; DEBYE MODELS; DECREASE LINEARLY; LATTICE THERMAL CONDUCTIVITY; SIMPLE RULES; SIZE DIFFERENCE; SPACE GROUPS; TETRAGONAL STRUCTURE; THERMOELECTRIC PERFORMANCE;

EID: 79961116209     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3610385     Document Type: Article
Times cited : (55)

References (26)
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    • 2/)T, where S, , and are the Seebeck coefficient, electrical conductivity, and thermal conductivity of the material and T is the operating temperature
    • 2/)T, where S, and are the Seebeck coefficient, electrical conductivity, and thermal conductivity of the material and T is the operating temperature.
  • 6
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    • L (1/3)C, where C is the specific heat, is the average acoustic mode phonon velocity, and L is the minimum phonon mean free path, which is estimated as the interatomic spacing. Values for C, , and L were found in Refs.
    • L (1/3)C, where C is the specific heat, is the average acoustic mode phonon velocity, and L is the minimum phonon mean free path, which is estimated as the interatomic spacing. Values for C, and L were found in Refs.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.