Thermal performance of plate-type loop thermosyphon at sub-atmospheric pressures

Applied Thermal Engineering

Volumn 31, Issue 14-15, 2011, Pages 2556-2567

  Tsoi, Vadim ^a   Chang, Shyy Woei ^b   Chiang, Kuei Feng ^c   Huang, Chuan Chin ^c  

^a Huawei Technology Sweden AB   (Sweden)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

^c Asia Vital Components Co Ltd   (Taiwan)

Author keywords

Low pressure plate type thermosyphon; Two phase loop thermosyphon

Indexed keywords

COOLING APPLICATIONS; COPPER PLATE; DIGITAL IMAGE; ELECTRONIC BOARDS; EXPERIMENTAL STUDIES; FILLING RATIO; FLAT PLATE; FORCED CONVECTIVE COOLING; HIGH-SPEED; HORIZONTAL PLATES; MULTI CHANNEL; NONEQUILIBRIUM CONDITIONS; PLATE-TYPE; PUMPING ACTION; SLUG FLOW; SUBATMOSPHERIC PRESSURES; TEST PLATE; THERMAL PERFORMANCE; THERMAL PHYSICS; THERMOSYPHONS; TWO-PHASE LOOP; VAPOR CHAMBER; VAPOR-LIQUID;

AGGLOMERATION; ATMOSPHERIC PRESSURE; CAPILLARY FLOW; COMPUTER NETWORKS; COOLING SYSTEMS; ELECTRONIC COOLING; LIQUIDS; MIXED CONVECTION; PHASE TRANSITIONS; PLATES (STRUCTURAL COMPONENTS); TELECOMMUNICATION SYSTEMS; THERMAL CONDUCTIVITY; VAPORS;

SIPHONS;

EID: 79960917854     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2011.04.021     Document Type: Article

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