Pitting and dealloying of solute-rich Al-Cu-Mg-based amorphous alloys: Effect of alloying with minor concentrations of nickel

Journal of the Electrochemical Society

Volumn 158, Issue 9, 2011, Pages

  Aburada, T ^a   Fitz Gerald, J M ^a   Scully, J R ^a  

^a University of Virginia   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AL-CU-MG ALLOYS; ANODIC DISSOLUTION; ARTIFICIAL PITS; CORROSION-RESISTANT; DEALLOYING; DISSOLUTION KINETICS; NANO-POROUS; NANOPOROUS STRUCTURES; OHMIC RESISTANCE; PITTING POTENTIAL; POROUS LAYERS; POTENTIAL DROP; SELECTIVE DISSOLUTION;

ALLOYING; ALLOYING ELEMENTS; ALLOYS; AMORPHOUS ALLOYS; COPPER ALLOYS; DISSOLUTION; HYDROCHLORIC ACID; OHMIC CONTACTS; PITTING; SODIUM CHLORIDE; STABILIZATION;

ALUMINUM;

EID: 79960912105     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3604392     Document Type: Article

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