Characterizing water soluble fluxes: Surface insulation resistance vs electrochemical migration

13th IEEE/CHMT International Electronics Manufacturing Technology Symposium - Integrated Manufacturing: The Future Is Now, IEMT 1992

Volumn , Issue , 1992, Pages 80-84

  Turbini, Laura J ^a   Jachim, Jenny A ^a   Freeman, Garth B ^a   Lane, James F ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 79960742666     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.1992.639866     Document Type: Conference Paper

References (7)

1. L. J. Turbini, M. P. Cassidy, B. C. Chung and G. W. Graham, "Evaluation of Flux Efficiency, Cleaning and Reliability", Proceedings of NEPCON West. pp 327-341 (February, 1982).
2. IPC-SF-818, "General Requirements for Electronic Soldering Fluxes", available from the Institute for Interconnecting and Packaging Electronic Circuits, 7380 North Lincoln Avenue, Lincoln wood, IL 60646.
3. D. K. Elliot, "Wet Electric Faults, Part 1 Dendrites", Supplement to IEEE Transactions on Aerospace, pp 247-251 (June, 1965).
4. J. P. Mitchell and T. L. Welsher, "Conductive Anodic Filament Growth in Printed Circuit Materials", Printed Circuit World Convention II, Munich, Germany, published as IPC Technical Report WC-2A-5 (June, 1981).
5. H. M. Naguib and B. K. MacLaurin, "Silver Migration and the Reliability of Pd/Ag Conductors in Thick Film Cross-Over Structures", IEEE Trans. Comp.. Hybrids and Mfg. Tech., CHMT-2, p. 196-207 (1979).
6. L. J. Turbini, J. Schodorf, I. Jachim, L. Lach, R. Mellitz and F. Sledd, "Developing a Standard Test Method to Identify Corrosive Soldering Flux Residues", Proceedings of the Third European Joint Conference, Brussels (June, 1992).
7. J. Brous, "Electrochemical Migration and Flux Residues Causes and Detection", Proceedings of NEPCON West, pp 386-393 (February, 1992).