Enhanced thermal conductivity of liquid paraffin based nanofluids containing copper nanoparticles

Journal of Dispersion Science and Technology

Volumn 32, Issue 7, 2011, Pages 948-951

  Yu, Wei ^a   Xie, Huaqing ^a   Wang, Xiaoping ^a  

^a SHANGHAI SECOND POLYTECHNIC UNIVERSITY   (China)

Author keywords

Copper nanoparticle; Dispersion; Nanofluid; Thermal conductivity

Indexed keywords

COPPER NANOPARTICLES; DISPERSANTS; EFFECTIVE THERMAL CONDUCTIVITY; HIGH THERMAL CONDUCTIVITY; LINEAR RELATIONSHIPS; LIQUID PARAFFINS; NANO-FLUID; NANOFLUIDS; SETTING TIME; SODIUM DODECYLBENZENESULFONATE; THERMAL CONDUCTIVITY ENHANCEMENT; THERMAL PERFORMANCE; TWO STEP METHOD;

COPPER; LIQUIDS; NANOFLUIDICS; NANOPARTICLES; PARAFFIN WAXES; PARAFFINS; SKIN; SODIUM;

THERMAL CONDUCTIVITY OF LIQUIDS;

EID: 79960497286     PISSN: 01932691     EISSN: 15322351     Source Type: Journal    
DOI: 10.1080/01932691.2010.488503     Document Type: Article

References (27)

1. Choi, S.U.S. (1995) In Developments and Applications of Non-Newtonian Flows, edited by D.A. Siginer and H.P. Wang; New York: ASME; FED-vol. 231=MD-vol. 66, pp. 99-105.
2. Murshed, S.M.S., Leong, K.C., and Yang, C. (2008) Appl. Therm. Eng., 28: 2109-2125.
3. Zhu, H., Zhang, C., Liu, S., Tang, Y., and Yin, Y. (2006) Appl. Phys. Lett., 89: 023123-1-023123-3.
4. Xie, H., Lee, H., Youn, W., and Choi, M. (2003) J. Appl. Phys., 94: 4967-4971.
5. Das, S.K., Choi, S.U.S., and Patel, H.E. (2006) Heat Transfer Eng., 27: 3-19.
6. Eastman, J.A., Phillpot, S.R., Choi, S.U.S., and Keblinski, P. (2004) Ann. Rev. Mater. Res., 34: 219-246.
7. Xie, H.Q., Fujii, M., and Zhang, X. (2005) Int. J. Heat Mass Transfer, 48: 2926-2932.
8. Liu, M.S., Lin, M.C.C., Tsai, C.Y., and Wang, C.C. (2006) Int. J. Heat Mass Transfer, 49: 3028-3033.
9. Zhu, H.T., Lin, Y.S., and Yin, Y.S. (2004) J. Colloid Interface Sci., 277: 100-103.
10. Eastman, J.A. (2001) Appl. Phys. Lett., 78: 718-720.
11. Li, X.F., Zhu, D.S., and Chen, G. (2007) In Proceedings of International Conference on Integration and Commercialization of Micro and Nano-Systems; Sanya, China, pp. 971-976.
12. Li, X.F., Zhu, D.S., and Wang, X.J. (2007) J. Colloid Interface Sci., 310: 456-463.
13. Li, X.F., Zhu, D.S., Wang, X.J., Wang, N., Gao, J.W., and Li, H. (2008) Thermochimica Acta, 469: 98-103.
14. Xie, H.Q., Gu, H., Fujii, M., and Zhang, X. (2006) Meas. Sci. Technol., 17: 208-214.
15. Yu, W.H., France, D.M., Routbort, J.L., and Choi, S. (2008) Heat Transfer Eng., 29: 432-460.
16. Chen, H.S., Yang, W., He, Y.R., Ding, Y.L., Zhang, L.L., and Tan, C.Q. (2008) Powder Technol., 183: 63-72.
17. Wang, X.Q. and Mujumdar, A.S. (2007) Int. J. Thermal Sci., 46: 1-19.
18. Tsai, C.Y., Chien, H.T., Ding, P.P., Chan, B., Luh, Y., and Chen, P.H. (2004) Mater. Lett., 58: 1461-1465.
19. Alavi, M.A. and Morsali, A. (2008) Ultrasonics Sonochemistry, 15: 833-838.
20. Das, S.J., Putra, N., and Roetzel, W. (2003) Int. J. Heat Trans., 46: 851-862.
21. Kim, S.H., Choi, S.R., and Kim, D.S. (2007) ASME J. Heat Transfer, 129: 298-307.
22. Chon, C.H. and Kihm, K.D. (2005) J. Heat Transfer, 127: 810.
23. Li, C.H. and Peterson, G.P. (2006) J. Appl. Phys., 99: 084314-1-084314-8.
24. Yang, B. and Han, Z.H. (2006) Appl. Phys. Lett., 89: 083111-1-083111-3.
25. Venerus, D.C., Kabadi, M., Lee, S., and Perez-Luna, S.V. (2006) J. Appl. Phys., 100: 094310-1-094310-5.
26. Timofeeva, E.V., Gavrilow, A.N., Mccloskey, J.M., Tolmachev, Y.V., Sprunt, S., Lopatina, L.M., and Selinger, J.V. (2007) Phys. Rev. E, 76: 061203-1-061203-10.
27. Chen, L.F., Xie, H.Q., Yang, L., and Yu, W. (2008) Thermochimica Acta, 477: 21-24.