A modified quasi-creep model for assessment of deformation of topas COC substrates in the thermal bonding of microfluidic devices: Experiments and modeling

Journal of Applied Polymer Science

Volumn 122, Issue 2, 2011, Pages 867-873

  Wang, Zhi Y ^a,b   Yue, Chee Y ^a,b   Lam, Yee C ^a,b   Roy, Sunanda ^a,b   Jena, Rajeeb K ^a,b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

COC; creep; modeling; thermal bonding; viscoelastic properties

Indexed keywords

BONDING PRESSURE; BONDING STRENGTH; BONDING TEMPERATURES; BURST TESTS; COC; COVER PLATE; CRITICAL TEMPERATURES; DEFORMATION BEHAVIOR; EXPERIMENTAL DATA; HIGHER T; HOLDING TIME; MICRO-FLUIDIC DEVICES; NUMERICAL MODELS; POLYMER PLATES; RESULTANT DEFORMATION; THERMAL BONDING; THERMOMECHANICAL PROPERTIES; THREE-POINT BENDING TEST; VISCOELASTIC CREEP; VISCOELASTIC PROPERTIES;

COMPUTER SIMULATION; CREEP; GLASS TRANSITION; INJECTION MOLDING; MICROCHANNELS; SUBSTRATES;

GLASS BONDING;

EID: 79960105962     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.34116     Document Type: Article

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