Thermophysical properties of copper composites reinforced with negative CTE fillers

Advances in Powder Metallurgy and Particulate Materials - 2006, Proceedings of the 2006 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2006

Volumn , Issue , 2006, Pages 937-943

  Neubauer, E ^a   Smid, I ^b   Requena, G ^c   Degischer, H P ^c   Angerer, P ^d  

^a ARC SEIBERSDORF RESEARCH GMBH   (Austria)

^b PENNSYLVANIA STATE UNIVERSITY   (United States)

^c VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

^d ECHEM Kompetenzzentrum fur Angewandte Elektrochemie GmbH   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOSITES; FILLER MATERIALS; HIGH THERMAL CONDUCTIVITY; LOW COEFFICIENT OF THERMAL EXPANSIONS; POWDER METALLURGICAL; RAPID SINTERING; ROOM TEMPERATURE; THERMAL EXPANSION BEHAVIOR;

COPPER; METALLIC MATRIX COMPOSITES; POWDER METALLURGY; REINFORCEMENT; SILICON CARBIDE; SINTERING; THERMAL CONDUCTIVITY; THERMODYNAMIC PROPERTIES;

FILLERS;

EID: 79960065190     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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