Composition of a thermal plasma formed from PTFE with copper in non-oxidant atmosphere, part I: Definition of a test case with the SF6

High Temperature Material Processes

Volumn 14, Issue 3, 2010, Pages 285-294

  Andre, P ^a   Koalaga, Z ^b  

^a UNIVERSITÉ CLERMONT AUVERGNE   (France)

^b Ouagadougou University   (Burkina Faso)

Author keywords

Carbon formation; Circuit breakers; Copper; Dielectric gas; Plasma composition; PTFE; SF6

Indexed keywords

CARBON FORMATION; CIRCUIT BREAKER; DIELECTRIC GAS; PLASMA COMPOSITION; SF6;

COPPER; DIELECTRIC PROPERTIES OF GASES; ELECTRIC PROPERTIES;

SULFUR HEXAFLUORIDE;

EID: 79960045448     PISSN: 10933611     EISSN: None     Source Type: Journal    
DOI: 10.1615/HighTempMatProc.v14.i3.70     Document Type: Article

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