Effects of wall slip and temperature jump on heat and mass transfer characteristics of an evaporating thin film

International Communications in Heat and Mass Transfer

Volumn 38, Issue 7, 2011, Pages 874-878

  Kou, Zhi Hai ^a   Bai, Min Li ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Evaporating thin film; Molecular dynamics simulation; Solid liquid interface; Temperature jump; Velocity slip

Indexed keywords

EVAPORATING THIN FILM; MOLECULAR DYNAMICS SIMULATIONS; SOLID-LIQUID INTERFACES; TEMPERATURE JUMP; VELOCITY SLIP;

COMPUTER SIMULATION; HEAT RESISTANCE; HEAT TRANSFER; LIQUIDS; MASS TRANSFER; MATHEMATICAL MODELS; MOLECULAR DYNAMICS; SURFACE TENSION; THIN FILMS; VELOCITY;

PHASE INTERFACES;

EID: 79960026915     PISSN: 07351933     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.icheatmasstransfer.2011.03.032     Document Type: Article

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