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Volumn 29, Issue 7, 2011, Pages 677-685

A study on the recycling of scrap integrated circuits by leaching

Author keywords

copper; gold; integrated circuit; metal; recovery; Recycling; silver

Indexed keywords

LEACHING PROCESS; NONFERROUS MATERIALS; PLASTIC RESINS; SEALING MATERIAL;

EID: 79959897574     PISSN: 0734242X     EISSN: 10963669     Source Type: Journal    
DOI: 10.1177/0734242X10380995     Document Type: Article
Times cited : (66)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.