On the thermal failure in nanoscale devices: Insight towards heat transport including critical BEOL and design guidelines for robust thermal management & EOS/ESD reliability

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2011, Pages

  Shrivastava, Mayank ^a   Agrawal, Manish ^b   Aghassi, Jasmin ^a   Gossner, Harald ^a   Molzer, Wolfgang ^a   Schulz, Thomas ^a   Ramgopal Rao, V ^b  

^a INTEL CORPORATION   (United States)

^b INDIAN INSTITUTE OF TECHNOLOGY BOMBAY   (India)

Author keywords

BEOL Reliability; Electrothermal; ESD; ETSOI; FinFET

Indexed keywords

BEOL RELIABILITY; ELECTROTHERMAL; ESD; ETSOI; FINFET;

DESIGN; ELECTROSTATIC DEVICES; ELECTROSTATIC DISCHARGE; GATES (TRANSISTOR); HEAT TRANSFER; INTEGRATED CIRCUITS; LOGIC CIRCUITS; TEMPERATURE CONTROL;

RELIABILITY;

EID: 79959291039     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IRPS.2011.5784498     Document Type: Conference Paper

References (9)

1. H. Kawasaki et. al., IEDM-2008.
2. Y. Jiang, et. al., IEDM 2008.
3. O. Weber et. al., IEDM, 2008.
4. Mayank Shrivastava, et. al., IEDM, 2009.
5. B. Swahn, et. al., Transactions on VLSI System, July 2008.
6. S. Kolluri, et. al., IEDM, 2007.
7. Predictive Technology Models [Online: www.eas.asu.edu/~ptm].
8. Harald Gossner, et. al., IEDM-2006.
9. Mayank Shrivastava, et. al., T-ED, June 2010.