-
1
-
-
4544225472
-
2.5 kV-6.5 kV industry standard IGBT modules setting a new benchmark in SOA capability
-
Nurenberg, Germany
-
M. Rahimo, A. Kopta, R. Schnell, U. Schlapbach, R. Zehringer, and S. Linder, "2.5 kV-6.5 kV industry standard IGBT modules setting a new benchmark in SOA capability," in Proc. PCIM, Nurenberg, Germany, 2004.
-
(2004)
Proc. PCIM
-
-
Rahimo, M.1
Kopta, A.2
Schnell, R.3
Schlapbach, U.4
Zehringer, R.5
Linder, S.6
-
2
-
-
0035304358
-
Optimized cooling systems for high-power semiconductor devices
-
DOI 10.1109/41.915408, PII S0278004601026284
-
H. Baumann, P. Heinemeyer, W. Staiger, M. Töpfer, K. Unger, and D. Müller, "Optimized cooling systems for high-power semiconductor devices," IEEE Trans. Ind. Electron., vol. 48, no. 2, pp. 298-306, Apr. 2001. (Pubitemid 32416257)
-
(2001)
IEEE Transactions on Industrial Electronics
, vol.48
, Issue.2
, pp. 298-306
-
-
Baumann, H.1
Heinemeyer, P.2
Staiger, W.3
Topfer, M.4
Unger, K.5
Muller, D.6
-
3
-
-
4043052854
-
Direct self-control and synchronous pulse techniques for high-power traction inverters in comparison
-
Aug.
-
A. Steimel, "Direct self-control and synchronous pulse techniques for high-power traction inverters in comparison," IEEE Trans. Ind. Electron., vol. 51, no. 4, pp. 810-820, Aug. 2004.
-
(2004)
IEEE Trans. Ind. Electron.
, vol.51
, Issue.4
, pp. 810-820
-
-
Steimel, A.1
-
4
-
-
33947273985
-
Weighted control of traction drives with parallel-connected ac machines
-
Dec.
-
A. Bouscayrol, M. Pietrzak-David, P. Delarue, R. Peña-Eguiluz, P.-E. Vidal, and X. Kestlyn, "Weighted control of traction drives with parallel-connected ac machines," IEEE Trans. Ind. Electron., vol. 53, no. 6, pp. 1799-1806, Dec. 2006.
-
(2006)
IEEE Trans. Ind. Electron.
, vol.53
, Issue.6
, pp. 1799-1806
-
-
Bouscayrol, A.1
Pietrzak-David, M.2
Delarue, P.3
Peña-Eguiluz, R.4
Vidal, P.-E.5
Kestlyn, X.6
-
5
-
-
60449103355
-
Power electronics and motor drives recent progress and perspective
-
Apr.
-
B. K. Bose, "Power electronics and motor drives recent progress and perspective," IEEE Trans. Ind. Electron., vol. 56, no. 2, pp. 581-588, Apr. 2006.
-
(2006)
IEEE Trans. Ind. Electron.
, vol.56
, Issue.2
, pp. 581-588
-
-
Bose, B.K.1
-
6
-
-
0003569807
-
-
2nd ed. Oxford, U.K.: Wiley
-
N. Mohan, T. M. Undeland, and W. P. Robbins, Power Electronics: Converters, Applications and Design, 2nd ed. Oxford, U.K.: Wiley, 1995.
-
(1995)
Power Electronics: Converters, Applications and Design
-
-
Mohan, N.1
Undeland, T.M.2
Robbins, W.P.3
-
7
-
-
0032083873
-
Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications
-
PII S0026271498001346
-
A. Hamidi, G. Coquery, R. Lallemand, P. Vales, and J. M. Dorkel, "Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications," Microelectron. Reliab., vol. 38, no. 6-8, pp. 1353-1359, Jun.-Aug. 1998. (Pubitemid 128634031)
-
(1998)
Microelectronics Reliability
, vol.38
, Issue.6-8
, pp. 1353-1359
-
-
Hamidi, A.1
Coquery, G.2
Lallemand, R.3
Vales, P.4
Dorkel, J.M.5
-
8
-
-
0035456914
-
Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter
-
DOI 10.1016/S0026-2714(01)00197-4, PII S0026271401001974
-
G. Coquery, S. Carubelli, J. P. Ousten, and R. Lallemand, "Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter," Microelectron. Reliab., vol. 41, no. 9/10, pp. 1695-1700, Sep./Oct. 2001. (Pubitemid 33147556)
-
(2001)
Microelectronics Reliability
, vol.41
, Issue.9-10
, pp. 1695-1700
-
-
Coquery, G.1
Carubelli, S.2
Ousten, J.P.3
Lallemand, R.4
Lecoq, F.5
Lhotellier, D.6
De Viry, V.7
Dupuy, Ph.8
-
9
-
-
0031378689
-
Power cycling reliability of IGBT power modules
-
New Orleans, LA
-
V. A. Sankaran, C. Chen, C. S. Avant, and X. Xu, "Power cycling reliability of IGBT power modules," in Conf. Rec. IEEE IAS Annu. Meeting, New Orleans, LA, 1997, pp. 1222-1227.
-
(1997)
Conf. Rec. IEEE IAS Annu. Meeting
, pp. 1222-1227
-
-
Sankaran, V.A.1
Chen, C.2
Avant, C.S.3
Xu, X.4
-
10
-
-
0028757872
-
Comparison of self-heating effects in bulk-silicon and SOI high voltage devices
-
San Francisco, CA
-
E. Arnold, H. Pein, and S. Herko, "Comparison of self-heating effects in bulk-silicon and SOI high voltage devices," in IEDM Tech. Dig., San Francisco, CA, 1994, pp. 813-816.
-
(1994)
IEDM Tech. Dig.
, pp. 813-816
-
-
Arnold, E.1
Pein, H.2
Herko, S.3
-
11
-
-
85029923572
-
Thermal stresses on railways traction inverter IGBT modules: Concept, methodology, results on sub-urban mass transit application to predictive maintenance
-
Toulouse, France
-
G. Coquery, M. Piton, R. Lallemand, S. Pagiusco, and A. Jeunesse, "Thermal stresses on railways traction inverter IGBT modules: Concept, methodology, results on sub-urban mass transit application to predictive maintenance," in Proc. EPE, Toulouse, France, 2003.
-
(2003)
Proc. EPE
-
-
Coquery, G.1
Piton, M.2
Lallemand, R.3
Pagiusco, S.4
Jeunesse, A.5
-
12
-
-
0036540853
-
Selected failure mechanisms of modern power modules
-
DOI 10.1016/S0026-2714(02)00042-2, PII S0026271402000422
-
M. Ciappa, "Selected failure mechanisms of modern power modules," Microelectron. Reliab., vol. 42, no. 4/5, pp. 653-667, Apr./May 2002. (Pubitemid 34498209)
-
(2002)
Microelectronics Reliability
, vol.42
, Issue.4-5
, pp. 653-667
-
-
Ciappa, M.1
-
13
-
-
79959324984
-
-
Ph.D. dissertation, Institut National Polytechnique de Lorraine, Lorraine, France
-
A. Hamidi, "Contribution à l'étude des phénomènes de fatigue thermique des modules IGBT de forte puissance destinés aux applications de traction," Ph.D. dissertation, Institut National Polytechnique de Lorraine, Lorraine, France, 1998.
-
(1998)
Contribution À L'étude des Phénomènes de Fatigue Thermique des Modules IGBT de Forte Puissance Destinés Aux Applications de Traction
-
-
Hamidi, A.1
-
14
-
-
34548677751
-
Failure-relevant abnormal events in power inverters considering measured IGBT module temperature inhomogeneities
-
DOI 10.1016/j.microrel.2007.07.071, PII S0026271407003137
-
X. Perpiñà, A. Castellazzi, M. Piton, M. Mermet-Guyennet, and J.Millán, "Failure-relevant abnormal events in power inverters considering measured IGBT module temperature inhomogeneities," Microelectron. Reliab., vol. 47, no. 9-11, pp. 1784-1789, Sep.-Nov. 2007. (Pubitemid 47418053)
-
(2007)
Microelectronics Reliability
, vol.47
, Issue.SPEC. ISS.
, pp. 1784-1789
-
-
Perpina, X.1
Castellazzi, A.2
Piton, M.3
Mermet-Guyennet, M.4
Millan, J.5
-
15
-
-
79959289978
-
Analysis of clamped inductive turn-off failure in railway traction IGBT power modules under overload conditions
-
Jul.
-
X. Perpiñà, J. F. Serviere, J. Urresti-Ibañez, I. Cortés, X. Jordà, S. Hidalgo, J. Rebollo, and M. Mermet-Guyennet, "Analysis of clamped inductive turn-off failure in railway traction IGBT power modules under overload conditions," IEEE Trans. Ind. Electron., vol. 58, no. 7, Jul. 2011.
-
(2011)
IEEE Trans. Ind. Electron.
, vol.58
, Issue.7
-
-
Perpiñà, X.1
Serviere, J.F.2
Urresti-Ibañez, J.3
Cortés, I.4
Jordà, X.5
Hidalgo, S.6
Rebollo, J.7
Mermet-Guyennet, M.8
-
16
-
-
0036755126
-
Power loss and junction temperature analysis of power semiconductor devices
-
DOI 10.1109/TIA.2002.802995, PII 1011092002802995
-
D. Xu, H. Lu, L. Huang, S. Azuma, M. Kimata, and R. Uchida, "Research on the power loss and junction temperature of power semiconductor devices," IEEE Trans Ind. Appl., vol. 38, no. 5, pp. 1426-1431, Sep./Oct. 2002. (Pubitemid 35303257)
-
(2002)
IEEE Transactions on Industry Applications
, vol.38
, Issue.5
, pp. 1426-1431
-
-
Xu, D.1
Lu, H.2
Huang, L.3
Azuma, S.4
Kimata, M.5
Uchida, R.6
-
17
-
-
79959311884
-
-
Marie Curie Transfer of Knowledge, MTKI-CT-2004-517224, EU funded project
-
Power Reliability for Traction Electronics (PORTES), Marie Curie Transfer of Knowledge, MTKI-CT-2004-517224, EU funded project.
-
Power Reliability for Traction Electronics (PORTES)
-
-
-
18
-
-
0003752614
-
-
3rd ed. Oxford, U.K.: Pergamon
-
P. D. Dunn and D. A. Reay, Heat Pipes, 3rd ed. Oxford, U.K.: Pergamon, 1983.
-
(1983)
Heat Pipes
-
-
Dunn, P.D.1
Reay, D.A.2
-
19
-
-
33751067010
-
-
Ph.D. dissertation, Université de Poitiers, Poitiers, France
-
C. Romestant, "Etudes théoriques et expérimentales de caloducs et de thermosiphons soumis à de fortes accelerations," Ph.D. dissertation, Université de Poitiers, Poitiers, France, 2000.
-
(2000)
Etudes Théoriques et Expérimentales de Caloducs et de Thermosiphons Soumis À de Fortes Accelerations
-
-
Romestant, C.1
-
20
-
-
0035422779
-
Thermal component model for electrothermal analysis of IGBT module systems
-
DOI 10.1109/6040.938309, PII S1521332301060282
-
C.-S. Yun, M. Ciappa, P. Malberti, and W. Fichtner, "Thermal component model for electrothermal analysis of IGBT module systems," IEEE Trans. Adv. Packag., vol. 24, no. 3, pp. 401-406, Aug. 2001. (Pubitemid 32780079)
-
(2001)
IEEE Transactions on Advanced Packaging
, vol.24
, Issue.3
, pp. 401-406
-
-
Yun, C.-S.1
Malberti, P.2
Ciappa, M.3
Fichtner, W.4
-
21
-
-
24144462863
-
Extraction of accurate thermal compact models for fast electro-thermal simulation of IGBT modules in hybrid electric vehicles
-
DOI 10.1016/j.microrel.2005.07.083, PII S0026271405002350
-
M. Ciappa, W. Fichtner, T. Kojima, Y. Yamada, and Y. Nishibe, "Extraction of accurate thermal compact models for fast electro-thermal simulation of IGBT modules in hybrid electric vehicles," Microelectron. Reliab., vol. 45, no. 9-11, pp. 1694-1699, Sep.-Nov. 2005. (Pubitemid 41231854)
-
(2005)
Microelectronics Reliability
, vol.45
, Issue.9-11
, pp. 1694-1699
-
-
Ciappa, M.1
Fichtner, W.2
Kojima, T.3
Yamada, Y.4
Nishibe, Y.5
-
23
-
-
79953738894
-
Current and temperature distribution in multi-chip modules under inverter operation
-
Lausanne, Switzerland
-
T. Franke, G. Zaiser, J. Otto, M. Honsberg-Riedl, and R. Sommer, "Current and temperature distribution in multi-chip modules under inverter operation," in Proc. EPE, Lausanne, Switzerland, 1999.
-
(1999)
Proc. EPE
-
-
Franke, T.1
Zaiser, G.2
Otto, J.3
Honsberg-Riedl, M.4
Sommer, R.5
-
24
-
-
0037972617
-
Lifetime prediction and design of reliability tests for high-power devices in automotive applications
-
Dallas, TX
-
M. Ciappa, F. Carbognani, P. Cova, and W. Fichtner, "Lifetime prediction and design of reliability tests for high-power devices in automotive applications," in Proc. IRPS, Dallas, TX, 2003, pp. 523-528.
-
(2003)
Proc. IRPS
, pp. 523-528
-
-
Ciappa, M.1
Carbognani, F.2
Cova, P.3
Fichtner, W.4
-
25
-
-
2442527850
-
Boundary element analysis of thermal fatigue effects on high power IGBT modules
-
Jun.
-
Z. Khatir and S. Lefebvre, "Boundary element analysis of thermal fatigue effects on high power IGBT modules," Microelectron. Reliab., vol. 44, no. 6, pp. 929-938, Jun. 2004.
-
(2004)
Microelectron. Reliab.
, vol.44
, Issue.6
, pp. 929-938
-
-
Khatir, Z.1
Lefebvre, S.2
-
26
-
-
27744504368
-
Accelerated temperature cycle test and Coffin-Mason model for electronic packaging
-
Alexandria, VA
-
H. Cui, "Accelerated temperature cycle test and Coffin-Mason model for electronic packaging," in Proc. RAMS, Alexandria, VA, 2005, pp. 556-560.
-
(2005)
Proc. RAMS
, pp. 556-560
-
-
Cui, H.1
-
27
-
-
54949111342
-
Temperature level effect on solder lifetime during thermal cycling of power modules
-
Sep.
-
M. Bouarroudj, Z. Khatir, J. P. Ousten, and S. Lefebvre, "Temperature level effect on solder lifetime during thermal cycling of power modules," IEEE Trans. Device Mater. Rel., vol. 8, no. 3, pp. 471-477, Sep. 2008.
-
(2008)
IEEE Trans. Device Mater. Rel.
, vol.8
, Issue.3
, pp. 471-477
-
-
Bouarroudj, M.1
Khatir, Z.2
Ousten, J.P.3
Lefebvre, S.4
-
29
-
-
77954835664
-
-
Ph.D. dissertation, École Centrale de Lille, Lille, France
-
S. Kreuawan, "Modelling and optimal design in railway applications," Ph.D. dissertation, École Centrale de Lille, Lille, France, 2008.
-
(2008)
Modelling and Optimal Design in Railway Applications
-
-
Kreuawan, S.1
-
33
-
-
0037972617
-
Lifetime prediction and design of reliability tests for high-power devices in automotive applications
-
Dallas, TX
-
M. Ciappa, F. Carbognani, P. Cova, and W. Fichtner, "Lifetime prediction and design of reliability tests for high-power devices in automotive applications," in Proc. IRPS, Dallas, TX, 2003, pp. 523-528.
-
(2003)
Proc. IRPS
, pp. 523-528
-
-
Ciappa, M.1
Carbognani, F.2
Cova, P.3
Fichtner, W.4
|