Phenylethynyl and phenol end-capping studies of polybiphenyloxydiphenylsilanes for cross-linking and enhanced thermal stability

Macromolecules

Volumn 44, Issue 11, 2011, Pages 4107-4115

  Drake, Kerry ^a,b   Mukherjee, Indraneil ^a   Mirza, Khalid ^a   Ji, Hai Feng ^a   Wei, Yen ^a  

^a DREXEL UNIVERSITY   (United States)

^b Tweed and Co   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIPHENOL; CAPPING REAGENTS; CURING REACTIONS; DICHLOROSILANES; END CAPPING; END-GROUPS; ETHYNYL; EXOTHERMIC PEAKS; FTIR; HIGH TEMPERATURE; PARALLEL PLATES; PHENOXY GROUPS; PHENYLETHYNYL; RAMAN ANALYSIS; RHEOMETRY; SILANOLS; SYNTHETIC ROUTES; THERMAL BEHAVIORS;

CONDENSATION REACTIONS; DIFFERENTIAL SCANNING CALORIMETRY; GROWTH (MATERIALS); MOLECULAR WEIGHT; PHENOLS; PHENOXY RESINS; THERMODYNAMIC STABILITY;

POLYMERS;

EID: 79958812502     PISSN: 00249297     EISSN: None     Source Type: Journal    
DOI: 10.1021/ma200099x     Document Type: Article

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