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Volumn 17, Issue 4, 2011, Pages 693-699
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The thermal evaluation of the substrate mixed with microencapsulated phase change materials for MEMS packaging applications
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Author keywords
[No Author keywords available]
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Indexed keywords
ADVANCED MATERIALS;
CONSERVE ENERGY;
CONSTANT TEMPERATURE;
CRITICAL ISSUES;
DURING PHASE;
HEAT TRANSFER BEHAVIOR;
HEAT TRANSFER EFFICIENCY;
HIGH HEAT FLUX;
HIGH POWER DENSITY;
HIGH THERMAL;
LIQUID STATE;
MANUFACTURING PROCESS;
MATRIX MATERIALS;
MEMS PACKAGING;
MICRO SYSTEMS TECHNOLOGIES;
MICROCAPSULES;
MICROENCAPSULATED PHASE CHANGE MATERIAL;
MONOLITHIC MATERIAL;
OPTOELECTRONIC INDUSTRY;
POLYMER SHELL;
STEADY STATE;
STORAGE CHARACTERISTIC;
THERMAL CONTROL;
THERMAL EVALUATIONS;
THERMAL MODULES;
THERMAL PERFORMANCE;
BUOYANCY;
CHIP SCALE PACKAGES;
ENCAPSULATION;
HEAT FLUX;
HEAT TRANSFER;
MICROELECTRONICS;
MICROSYSTEMS;
MIXED CONVECTION;
PACKAGING MATERIALS;
SUBSTRATES;
TEMPERATURE CONTROL;
PHASE CHANGE MATERIALS;
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EID: 79958784303
PISSN: 09467076
EISSN: None
Source Type: Journal
DOI: 10.1007/s00542-010-1154-1 Document Type: Conference Paper |
Times cited : (7)
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References (7)
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