The effect of dissolved oxygen on the rate of pulsed electrodeposition of copper and bismuth nanowires under the conditions of template synthesis

Russian Journal of Electrochemistry

Volumn 47, Issue 3, 2011, Pages 357-360

  Globa, P G ^a   Sidel'nikova S P ^a   Tsyntsaru, N I ^a   Dikusar, A I ^a  

^a INSTITUTE OF APPLIED PHYSICS   (Moldova)

Author keywords

Bismuth; Copper; Corrosion; Electrodeposition; Nanotechnology; Porous electrode; Reduction of oxidant; Template synthesis; Ultramicroelectrodes

Indexed keywords

ALUMINA; ALUMINUM COATINGS; ALUMINUM OXIDE; BISMUTH; BISMUTH COMPOUNDS; COPPER; COPPER COMPOUNDS; COPPER CORROSION; CORROSION; DEPOSITION RATES; ELECTROCHEMICAL DEPOSITION; ELECTRODEPOSITION; ELECTROLYTES; INERT GASES; MASS TRANSFER; MICROELECTRODES; NANOTECHNOLOGY; NANOWIRES; REDUCTION;

COPPER DEPOSITION; INERT GAS ATMOSPHERE; MATERIAL CORROSION; NITRATE SOLUTIONS; POROUS ELECTRODES; PULSED ELECTRODEPOSITION; TEMPLATE SYNTHESIS; ULTRA MICROELECTRODES;

DISSOLVED OXYGEN;

EID: 79958195518     PISSN: 10231935     EISSN: 16083342     Source Type: Journal    
DOI: 10.1134/S1023193510121018     Document Type: Article

References (22)

1. Whitney, T.M., Jiang, J.S., Searson, P.S., and Chien, C.L., Science, 1993, vol. 261, p. 1316.
2. Martin, C.R., Science, 1994, vol. 266, p. 1961.
3. Schonenberger, C., van der Zande, B.M.I., Fokkink, L.G.J., Henny, M., Schmid, C., Kruger, M., Bachtoldb, A., Huber, R., Brik, H., and Staufer, U., J. Phys. Chem. B, 1997, vol. 101, p. 5497.
4. He, H. and Tao, N.J., Electrochemical Fabrication of Metal Nanowires: In Encyclopedia of Nanoscience and Nanotechnology, Electronic Publishing Solutions, 2004, vol. 2, no. 1, p. 755.
5. Ugo, P. and Moreno, L.M., Handbook of Electrochemistry, Elsevier, 2007, p. 678.
6. Foss, C.A., Hornyak, G.L., Jr., Stocket, J.A., and Martin, C.R., J. Phys. Chem., 1992, vol. 96, p. 7497.
7. Foss, C.A., Hornyak, G.L., Jr., Stocket, J.A., and Martin, C.R., J. Phys. Chem., 1994, vol. 98, p. 2963.
8. Preston, C.K. and Moskovits, M.J., J. Phys. Chem., 1993, vol. 97, p. 8495.
9. Sellmyer, D.J., Zheng, M., and Skimski, R., J. Phys. Condens. Matter, 2001, vol. 13, p. R433.
10. Dickson, R.M. and Lyon, L.A., Phys. Chem. B, 2000, vol. 104, p. 6095.
11. Nielsch, K., Muller, F., Li, A.-P., and Gosele, U., Adv. Mater., 2000, vol. 12, p. 582.
12. Sauer, G., Breshm, G., Schneider, S., Nielsch, K., Wrhrspoon, R.B., Choi, J., Hoffmeister, H., and Gosele, J., J. Appl. Phys., 2002, vol. 91, p. 3243.
13. Ramazani, A., Almashi Kashi, M., and Erfanifani, S., Mater. Chem. Phys., 2008, vol. 112, no. 1, p. 285.
14. Dikusar, A.I., Globa, P.G., Belevskii, S.S., and Sidelinikova, S.P., Surf. Eng. Appl. Electrochem, 2009, vol. 45, no. 3, p. 171.
15. Globa, P.G., Sidelinikova, S.P., Dikusar, A.I., Zasavitskii, E.A., and Kantser, V.G., Surf. Eng. Appl. Electrochem, 2006, vol. 42, no. 3, p. 1.
16. Marlot, A., Kern, P., and Landolt, D., Electrochim. Acta, 2002, vol. 48, no. 1, p. 29.
17. Maslii, A.I., Poddubnyi, N.P., and Medvedev, A.Zh., Elektrokhimiya, 2006, vol. 42, p. 899
18. Maslii A.I., Roddubnui N.R., Medvedev A.Zh., Russ. J. Electrochem., 2006, vol. 42, p. 807.
19. Wang, X.F., Zhang, L.D., Zhang, J., Shi, H.Z., Reng, X.F., Zheng, M.J., Fang, J., Chen, J.L., and Gao, B.J., J. Phys. D: Appl. Phys., 2001, vol. 34, p. 418.
20. Baranov, S.A., Globa, P.G., Yushchenko, S.P., and Dikusar, A.I., Elektron. Obrabotka Materialov, 2010, no. 2, p. 4.
21. Damaskin, B.B., Petrii, O.A., and Tsirlina, G.A., Elektrokhimiya (Electrochemistry), Moscow: Khimiya, 2006, p. 457.
22. Grikhiles, S.Ya. and Tikhonov, K.I., Elektroliticheskie i khimicheskie pokrytiya. Teoriya i praktika (Electrolytic and Chemical Coatings: Theory and Practice), Leningrad: Khimiya, 1990, p. 87.