Atomic layer deposition of conductive coatings on cotton, paper, and synthetic fibers: Conductivity analysis and functional chemical sensing using "all-fiber" capacitors

Advanced Functional Materials

Volumn 21, Issue 11, 2011, Pages 1993-2002

  Jur, Jesse S ^a   Sweet III, William J ^b   Oldham, Christopher J ^b   Parsons, Gregory N ^b  

^a NORTH CAROLINA STATE UNIVERSITY   (United States)

^b North Carolina State University   (United States)

Author keywords

flexible electronics; functional coatings; hybrid materials; organic electronics; sensors

Indexed keywords

ALL FIBER; CAPACITOR STRUCTURES; COMPLEX SURFACE; CONDUCTANCE VALUES; CONDUCTIVE COATINGS; CONDUCTIVE FIBERS; CONDUCTIVITY ANALYSIS; EFFECTIVE CONDUCTIVITY; ELECTRICAL CONDUCTIVITY; ELECTROLESS; ELECTRONIC TEXTILES; ENERGY SYSTEMS; FIBER MATERIALS; FIBER SYSTEMS; FIBROUS MATERIAL; FIBROUS NETWORKS; FIELD DIRECTIONS; FILM COATINGS; FUNCTIONAL CHEMICALS; FUNCTIONAL COATINGS; FUNCTIONAL SYSTEMS; FUNCTIONALIZATIONS; LIQUID CHEMICALS; LIQUID MEDIA; METAL-INSULATOR-METAL CAPACITORS; NEW APPLICATIONS; NORMAL FORCES; NYLON FIBER; ORGANIC ELECTRONICS; QUARTZ FIBERS; ZNO FILMS;

ATOMIC LAYER DEPOSITION; ATOMS; CAPACITORS; CHEMICAL ANALYSIS; CHEMICAL SENSORS; CONDUCTIVE MATERIALS; COTTON; COTTON FIBERS; ELECTRIC CONDUCTIVITY; FLEXIBLE ELECTRONICS; GLASS FIBERS; HYBRID MATERIALS; LIQUIDS; METAL INSULATOR BOUNDARIES; PROTECTIVE COATINGS; QUARTZ; SILVER PLATING; TEXTILES; THICKNESS MEASUREMENT; TUNGSTEN; TUNGSTEN PLATING; ZINC OXIDE;

FIBERS;

CAPACITORS; CHEMICAL ANALYSIS; COATINGS; COTTON; ELECTRONICS; FIBERS; GLASS FIBERS; LIQUIDS; PROTECTIVE COATINGS; QUARTZ; RESISTIVITY; SENSORS; TEXTILES; TUNGSTEN; ZINC OXIDE;

EID: 79957958706     PISSN: 1616301X     EISSN: 16163028     Source Type: Journal    
DOI: 10.1002/adfm.201001756     Document Type: Article

References (46)

1. a) M. A. Dinderman, W. J. Dressick, C. N. Kostelansky, R. R Price, P. E. Schoen, Chem. Mater. 2006, 18, 4361
2. b) P. Sarrazin, L. Valecce, D. Beneventi, D. Chaussy, L. Vurth, O. Stephan, Adv. Mater. 2007, 19, 3291
3. c) L. B. Hu, J. W. Choi, Y. Yang, S. Jeong, F. La Mantia, L. F. Cui, Y. Cui, Proc. Natl. Acad. Sci. U. S. A. 2009, 106, 21490
4. d) G. Nyström, A. Razaq, M. Strømme, L. Nyholm, A. Mihranyan, Nano Lett. 2009, 9, 3635
5. e) A. Varesano, A. Aluigi, L. Florio, R. Fabris, Synth. Met. 2009, 159, 1082.
6. M. Agarwal, Y. Lvov, K. Varahramyan, Nanotechnology. 2006, 17, 5319.
7. Y. Aoki, J. G. Huang, T. Kunitake, J. Mater. Chem. 2006, 16, 292.
8. M. Kemell, V. Pore, M. Ritala, M. Leskela, Chem. Vap. Deposition. 2006, 12, 419.
9. R. Pelton, X. L. Geng, M. Brook, Adv. Colloid Interface Sci. 2006, 127, 43.
10. a) M. Kemell, M. Ritala, M. Leskelä, R. Groenen, S. Lindfors, Chem. Vap. Deposition. 2008, 14, 347
11. b) Y. S. Shin, X. H. S. Li, C. M. Wang, J. R. Coleman, G. J. Exarhos, Adv. Mater. 2004, 16, 1212.
12. M. Alava, K. Niskanen, Rep. Prog. Phys. 2006, 69, 669.
13. a) J. H. He, T. Kunitake, A. Nakao, Chem. Mater. 2003, 15, 4401
14. b) A. Rida, L. Yang, R. Vyas, M. M. Tentzeris, IEEE Antennas and Propagation Magazine. 2009, 51, 13
15. c) S. Zakaria, B. H. Ong, S. H. Ahmad, M. Abdullah, T. Yamauchi, Mater. Chem. Phys. 2005, 89, 216.
16. L. B. Hu, M. Pasta, F. La Mantia, L. F. Cui, S. Jeong, H. D. Deshazer, J. W. Choi, S. M. Han, Y. Cui, Nano Lett. 2010, 10, 708.
17. a) R. E. Anderson, J. W. Guan, M. Ricard, G. Dubey, J. Su, G. Lopinski, G. Dorris, O. Bourne, B. Simard, J. Mater. Chem. 2010, 20, 2400
18. b) J. Jang, S. K. Ryu, J. Mater. Process. Technol. 2006, 180, 66.
19. D. Zabetakis, M. Dinderman, P. Schoen, Adv. Mater. 2005, 17, 734.
20. a) R. A. Caruso, Angew. Chem., Int. Ed. 2004, 43, 2746
21. b) J. Huang, N. Matsunaga, K. Shimanoe, N. Yamazoe, T. Kunitake, Chem. Mater. 2005, 17, 3513
22. c) J. G. Huang, T. Kunitake, J. Am. Chem. Soc. 2003, 125, 11834.
23. a) C. Q. Peng, Y. S. Thio, R. A. Gerhardt, Nanotechnology. 2008, 19, 505603
24. I. Wistrand, R. Lingstrom, L. Wagberg, Eur. Polym. J. 2007, 43, 4075.
25. B. Huang, G. J. Kang, Y. Ni, Pulp Pap. Can. 2006, 107, 38.
26. a) L. M. Gao, E. T. Thostenson, Z. Zhang, T. W. Chou, Adv. Funct. Mater. 2009, 19, 123
27. b) N. Grossiord, J. Loos, L. van Laake, M. Maugey, C. Zakri, C. E. Koning, A. J. Hart, Adv. Funct. Mater. 2008, 18, 3226
28. c) H. Yoon, J. Jang, Adv. Funct. Mater. 2009, 19, 1567.
29. G. K. Hyde, S. D. McCullen, S. Jeon, S. M. Stewart, H. Jeon, E. G. Loboa, G. N. Parsons, Biomed. Mater. 2009, 4, 025001.
30. G. K. Hyde, K. J. Park, S. M. Stewart, J. P. Hinestroza, G. N. Parsons, Langmuir. 2007, 23, 9844.
31. G. K. Hyde, G. Scarel, J. C. Spagnola, Q. Peng, K. Lee, B. Gong, K. G. Roberts, K. M. Roth, C. A. Hanson, C. K. Devine, S. M. Stewart, D. Hojo, J. S. Na, J. S. Jur, G. N. Parsons, Langmuir. 2009, 26, 2550.
32. J. S. Jur, J. C. Spagnola, K. Lee, B. Gong, Q. Peng, G. N. Parsons, Langmuir. 2010, 26, 8239.
33. M. Kemell, V. Pore, M. Ritala, M. Leskelä, M. Linden, J. Am. Chem. Soc. 2005, 127, 14178.
34. a) M. Leskelä, and, M. Ritala, Angew. Chem., Int. Ed. 2003, 42, 5548
35. b) S. M. George, Chem. Rev. 2010, 110, 111.
36. a) B. Y. Deng, Q. F. Wei, W. D. Gao, J. Coat. Technol. Res. 2008, 5, 393
37. b) N. J. Pinto, P. Carrion, J. X. Quinones, Mater. Sci. Eng., A. 2004, 366, 1.
38. American Society for Testing and Materials, 2006, ASTM Designation: D-4496-04.
39. Y. Shacham-Diamand, A. Inberg, Y. Sverdlov, N. Croitoru, J. Electrochem. Soc. 2000, 147, 3345.
40. J. S. Na, Q. Peng, G. Scarel, G. N. Parsons, Chem. Mater. 2009, 21, 5585.
41. M. Schuisky, J. W. Elam, S. M. George, Appl. Phys. Lett. 2002, 81, 180.
42. Q. Peng, X. Y. Sun, J. C. Spagnola, G. K. Hyde, R. J. Spontak, G. N. Parsons, Nano Lett. 2007, 7, 719.
43. J. S. Na, G. Scarel, G. N. Parsons, J. Phys. Chem. C 2010, 114, 383.
44. J. P. Richters, T. Voss, D. S. Kim, R. Scholz, M. Zacharias, Nanotechnology 2008, 19, 305202.
45. E. Guziewicz, M. Godlewski, T. A. Krajewski, Ś. Wachnicki, G. Śuka, W. Paszkowicz, J. Z. Domagała, E. Przez'dziecka, E. Śusakowska, B. S. Witkowski, Acta Phys. Pol., A 2009, 116, 814.
46. J. W. Klaus, S. J. Ferro, S. M. George, Thin Solid Films 2000, 360, 145.