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Volumn 11, Issue 13, 2011, Pages 2436-2439

Concentration profile behavioral from digestate television printed circuit board for metal recovery via electrolysis

Author keywords

Aqua regia; E waste; Electrolysis; Metal recovery

Indexed keywords


EID: 79957522612     PISSN: 18125654     EISSN: 18125662     Source Type: Journal    
DOI: 10.3923/jas.2011.2436.2439     Document Type: Article
Times cited : (3)

References (10)
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    • 2942626242 scopus 로고    scopus 로고
    • The effect of a curing agent on the thermal degradation of fire retardant brominated epoxy resins
    • Balabanovich, A.I., A. Hornung, D. Merz and H. Seifert, 2004. The effect of a curing agent on the thermal degradation of fire retardant brominated epoxy resins. Polym. Degrad. Stabil., 85: 713-723.
    • (2004) Polym. Degrad. Stabil , vol.85 , pp. 713-723
    • Balabanovich, A.I.1    Hornung, A.2    Merz, D.3    Seifert, H.4
  • 4
    • 65549088809 scopus 로고    scopus 로고
    • Malaysia Environmental Quality Report 2007
    • DOE, Ministry of Science, USA
    • DOE, 2007. Malaysia Environmental Quality Report 2007. Department of Environment Malaysia, Ministry of Science, USA.
    • (2007) Department of Environment Malaysia
  • 7
    • 0036784213 scopus 로고    scopus 로고
    • Thermal decomposition of the retardant brominated epoxy resins
    • Luda, M.P., A.I. Balabanovich and G. Camino, 2002. Thermal decomposition of the retardant brominated epoxy resins. J. Anal. Appl. Pyrol., 65: 25-40.
    • (2002) J. Anal. Appl. Pyrol , vol.65 , pp. 25-40
    • Luda, M.P.1    Balabanovich, A.I.2    Camino, G.3
  • 9
    • 0010406109 scopus 로고
    • Degradation of Brominated Epoxy Resin and Effects on Integrated-Circuit-Device wirebonds
    • Lupinski, J.H. and R.S. Moore (Eds.). ACS, Washington, pp
    • Nakao, M., T. Nishioka, S. Shimizu, H. Tabata and K. Ito, 1989. Degradation of Brominated Epoxy Resin and Effects on Integrated-Circuit-Device wirebonds. In: Polymeric Materials for Electronic Packaging and Interconnection, Lupinski, J.H. and R.S. Moore (Eds.). ACS, Washington, pp: 421-428.
    • (1989) Polymeric Materials For Electronic Packaging and Interconnection , pp. 421-428
    • Nakao, M.1    Nishioka, T.2    Shimizu, S.3    Tabata, H.4    Ito, K.5
  • 10
    • 0038693239 scopus 로고    scopus 로고
    • Selective leaching of valuable metals from waste printed circuit boards
    • Oh, CJ., S.O. Lee, H.S. Yang, T.J. Ha and M.J. Kim, 2003. Selective leaching of valuable metals from waste printed circuit boards. J. Air Waste Manage. Assoc, 53: 897-902.
    • (2003) J. Air Waste Manage. Assoc , vol.53 , pp. 897-902
    • Oh, C.J.1    Lee, S.O.2    Yang, H.S.3    Ha, T.J.4    Kim, M.J.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.