Electrodeposition and growth mechanism of copper sulfide nanowires

Journal of Physical Chemistry C

Volumn 115, Issue 19, 2011, Pages 9320-9334

  Ghahremaninezhad, A ^a   Asselin, E ^a   Dixon, D G ^a  

^a UNIVERSITY OF BRITISH COLUMBIA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC PULSE; CATHODIC PULSE; CODEPOSITION; COMPLEXING AGENTS; COPPER IONS; COPPER SULFIDES; COVELLITE; DIFFUSION CONTROLLED GROWTH; ELECTROPLATING BATH; GROWTH BEHAVIOR; GROWTH MECHANISMS; GROWTH PROCESS; HIGH BRIGHTNESS; KEY FACTORS; NANOWIRE GROWTH; PRODUCT MORPHOLOGY; PULSED POTENTIAL ELECTRODEPOSITION; SINGLE-STEP; SULFUR SOURCE;

COPPER; COPPER COMPOUNDS; CORROSION INHIBITORS; CYCLIC VOLTAMMETRY; DEPOSITS; DISSOLUTION; ELECTROCHEMICAL CORROSION; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; ELECTRODEPOSITION; HIGH RESOLUTION ELECTRON MICROSCOPY; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; METAL IONS; NANOWIRES; PHOTOELECTRON SPECTROSCOPY; SULFUR; THIOUREAS; TRANSMISSION ELECTRON MICROSCOPY; UREA; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER DEPOSITS;

EID: 79956121867     PISSN: 19327447     EISSN: 19327455     Source Type: Journal    
DOI: 10.1021/jp108283z     Document Type: Article

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