Effect of Stress Ratio on Fatigue Crack Growth in 95Pb-5Sn Solder

Journal of Electronic Packaging

Volumn 123, Issue 3, 2001, Pages 311-315

  Zhao, J ^a   Mutoh, Y ^a   Ogawa, T ^b  

^a NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

^b AOYAMA GAKUIN UNIVERSITY   (Japan)

Author keywords

Crack Closure; Cyclic Dependence; Fatigue Crack Growth; Solder; Stress Ratio

Indexed keywords

BINARY ALLOYS; CRACK TIPS; FATIGUE CRACK PROPAGATION; GRAIN BOUNDARIES; LEAD ALLOYS; LEAD-FREE SOLDERS; TEXTURES; TIN ALLOYS;

CRACK GROWTH DATA; CYCLIC DEPENDENCE; EFFECT OF STRESS; FATIGUE CRACK GROWTH BEHAVIOR; NEAR THRESHOLDS; STRESS RATIO; TEST CONDITION; THRESHOLD REGIONS; TRANSGRANULAR FRACTURE;

CRACK CLOSURE;

EID: 79956108079     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.1371780     Document Type: Article

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