Screening beneficial dopants to Cu interconnects by modeling

Applied Physics Letters

Volumn 80, Issue 5, 2002, Pages 763-765

  Liu, Chun Li ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

A-CARBON; BULK DIFFUSIONS; CU ALLOY; CU DIFFUSION; CU-INTERCONNECTS; DOPANT SEGREGATION; FIRST-PRINCIPLES SIMULATIONS; MEAN TIME TO FAILURE; MODEL PREDICTION; PRIMARY MECHANISM; SELF-DIFFUSION;

COPPER ALLOYS; DIFFUSION; GRAIN BOUNDARIES;

DOPING (ADDITIVES);

EID: 79956008500     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1445471     Document Type: Article

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