A successful implementation of dual damascene architecture to copper TSV for 3D high density applications

IEEE 3D System Integration Conference 2010, 3DIC 2010

Volumn , Issue , 2010, Pages

  El Farhane, Rebha ^a   Assous, Myriam ^a   Leduc, Patrick ^a   Thuaire, Aurélie ^a   Bouchu, David ^a   Feldis, Helene ^a   Sillon, Nicolas ^a  

^a CEA LETI   (France)

Author keywords

[No Author keywords available]

Indexed keywords

DUAL DAMASCENE ARCHITECTURE; DUAL DAMASCENE INTEGRATION; HIGH DENSITY; HIGH-DENSITY APPLICATIONS; INTERNAL COSTS; MANUFACTURABILITY; REDISTRIBUTION LAYERS; SINGLE DAMASCENE; THROUGH SILICON VIAS;

COST REDUCTION; INTEGRATION; THREE DIMENSIONAL;

COST BENEFIT ANALYSIS;

EID: 79955979086     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2010.5751445     Document Type: Conference Paper

References (4)

1. E. Jan Vardaman, "3D with Through Silicon Vias: Markets and Applications", RTI 2007.
2. Yole development report, 2008.
3. ITRS 2007
4. P. Leduc, et al., MRS fall, 2008