SCOPUS 정보 검색 플랫폼

Journal of Information and Computational Science

Volumn 8, Issue 3, 2011, Pages 570-578

Multi-scale simulation and system architecture for thermal engineering design of digital clothing

(4) Mao, Aihua a Luo, Jie b Li, Yi b Wang, Ruomei c

a SOUTH CHINA UNIVERSITY OF TECHNOLOGY (China)

b HONG KONG POLYTECHNIC UNIVERSITY (Hong Kong)

c SUN YAT SEN UNIVERSITY (China)

Author keywords

Digital clothing; Software architecture; Thermal engineering design

Indexed keywords

CAD TECHNOLOGIES; DESIGN REQUIREMENTS; DIGITAL CLOTHING; MULTI-SCALE SIMULATION; MULTI-SCALE SIMULATION METHOD; NEW APPLICATIONS; SYSTEM ARCHITECTURES; THERMAL ENGINEERING; THERMAL ENGINEERING DESIGN; THERMAL PERFORMANCE; THERMAL PROTECTION;

COMPUTER SOFTWARE; ENGINEERING; SOFTWARE ARCHITECTURE; THERMOANALYSIS;

COMPUTER AIDED DESIGN;

EID: 79955976147 PISSN: 15487741 EISSN: None Source Type: Journal
DOI: None Document Type: Article

Times cited : (4)

References (7)

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5
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6
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7
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.