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Volumn 40, Issue 5, 2011, Pages 884-888
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Thermal stress analysis and structure parameter selection for a Bi 2Te 3-based thermoelectric module
a,b
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Author keywords
conversion efficiency; output power; thermal stress; thermoelectric material; Thermoelectric modules (TEMs)
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Indexed keywords
ANISOTROPIC MECHANICAL PROPERTIES;
ANSYS SOFTWARE;
CLEAVAGE PLANE;
ELECTRICAL RESISTIVITY;
FINITE ELEMENT ANALYSIS;
HARSH ENVIRONMENT;
MATERIAL PROPERTY;
MECHANICAL PERFORMANCE;
OUTPUT POWER;
STRUCTURE PARAMETER;
TEM;
THERMAL STRESS DISTRIBUTIONS;
THERMAL STRESS RESISTANCE;
THERMOELECTRIC MATERIAL;
THERMOELECTRIC MODULES;
THERMOELECTRIC PROPERTIES;
BISMUTH;
CONVERSION EFFICIENCY;
ELECTRIC CONDUCTIVITY;
EQUIVALENT CIRCUITS;
FINITE ELEMENT METHOD;
MECHANICAL PROPERTIES;
STRESS ANALYSIS;
STRESS CONCENTRATION;
THERMAL STRESS;
THERMOELASTICITY;
THERMOELECTRIC EQUIPMENT;
THERMOELECTRICITY;
THERMAL CONDUCTIVITY;
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EID: 79955919115
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-011-1611-3 Document Type: Conference Paper |
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Times cited : (121)
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References (6)
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