A low sintering temperature and electrical performance of nanoparticle copper ink for use in ink-jet printing

Journal of Nanoscience and Nanotechnology

Volumn 10, Issue 10, 2010, Pages 6888-6891

  Cho, M S ^a   Choi, W H ^a   Kim, S G ^a   Kim, I H ^a   Lee, Y ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Cu nanoparticles; Metal nano ink; Sintering

Indexed keywords

CAPPING AGENT; CONDUCTING FILMS; COPPER CHLORIDES; COPPER NANOPARTICLES; CU FILMS; CU NANOPARTICLES; ELECTRICAL PERFORMANCE; ELECTRICAL RESISTIVITY; HIGH SURFACE AREA; LOW SINTERING TEMPERATURE; LOW TEMPERATURES; N-TETRADECANE; NANOPARTICLE COPPER; SOLUTION DEPOSITION; VOLUME RATIO;

CHLORINE COMPOUNDS; CONDUCTIVE FILMS; ELECTRIC CONDUCTIVITY; INK; INK JET PRINTING; METALLIC FILMS; NANOPARTICLES; SINTERING;

COPPER;

EID: 79955527557     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2010.2977     Document Type: Conference Paper

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