Influence of the electrochemical parameters on the properties of electroplated Au-Cu alloys

Journal of the Electrochemical Society

Volumn 158, Issue 4, 2011, Pages

  Brun, Etienne ^a,b   Durut, Frédéric ^a   Botrel, Ronan ^a   Theobald, Marc ^a   Legaie, Olivier ^a   Popa, Ioana ^b   Vignal, Vincent ^b  

^a DIF   (France)

^b LABORATOIRE INTERDISCIPLINAIRE CARNOT DE BOURGOGNE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ALKALINE CYANIDE; AVERAGE GRAIN SIZE; COPPER CONTENT; CU ALLOY; DIRECT CURRENT PLATING; ELECTROCHEMICAL BEHAVIOUR; ELECTROCHEMICAL PARAMETERS; GOLD SUBSTRATES; GRAIN SIZE; HALL-PETCH RELATION; PLATING BATH; REDUCTION POTENTIAL;

CERIUM ALLOYS; COATINGS; COPPER; COPPER ALLOYS; COPPER DEPOSITS; CYANIDES; CYCLIC VOLTAMMETRY; DEPOSITS; ELECTROCHEMICAL PROPERTIES; ELECTROPLATING; GOLD; GOLD ALLOYS; GRAIN SIZE AND SHAPE; MICROHARDNESS; REDUCTION; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION;

NANOCRYSTALLINE ALLOYS;

EID: 79955161356     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3554727     Document Type: Article

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