Octa(aminophenyl) polyhedral oligomeric silsesquioxane/boron-containing phenol-formaldehyde resin nanocomposites: Synthesis, cured, and thermal properties

Polymer Composites

Volumn 32, Issue 5, 2011, Pages 829-836

  Gao, Jungang ^a   Li, Xing ^a   Wu, Weihong ^a   Lin, Haojie ^a  

^a HEBEI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BORON-CONTAINING; FIRST ORDER; MECHANICAL LOSS; PEAK TEMPERATURES; PHENOL-FORMALDEHYDE RESIN; POLYHEDRAL OLIGOMERIC SILSESQUIOXANES; RESIDUAL RATIOS; THERMAL DEGRADATIONS; THERMAL PROPERTIES; THREE STAGES;

ACTIVATION ENERGY; BORON; BORON COMPOUNDS; DEGRADATION; FORMALDEHYDE; OLIGOMERS; PHENOLIC RESINS; PHENOLS; SYNTHETIC RESINS; THERMODYNAMIC PROPERTIES;

NANOCOMPOSITES;

EID: 79955039878     PISSN: 02728397     EISSN: 15480569     Source Type: Journal    
DOI: 10.1002/pc.21105     Document Type: Article

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