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Electrochemical and Solid-State Letters

Volumn 14, Issue 6, 2011, Pages

Highly selective Cu electrodeposition for filling through silicon holes

(4) Dow, Wei Ping a Lu, Chun Wei a Lin, Jing Yuan b Hsu, Fu Chiang b

a NATIONAL CHUNG HSING UNIVERSITY (Taiwan)

b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP STACKING; COPPER CHEMICAL-MECHANICAL POLISHING; ORGANIC ADDITIVES; POST-THERMAL ANNEALING; PROCESS STEPS; THROUGH SILICON VIAS;

CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; CHIP SCALE PACKAGES; COPPER PLATING; THREE DIMENSIONAL;

COPPER;

EID: 79953785489 PISSN: 10990062 EISSN: None Source Type: Journal
DOI: 10.1149/1.3562278 Document Type: Article

Times cited : (42)

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