First power cycling results of improved packaging technologies for hybrid electrical vehicle applications

2010 6th International Conference on Integrated Power Electronics Systems, CIPS 2010

Volumn , Issue , 2011, Pages

  Hensler, Alexander ^a   Lutz, Josef ^a   Thoben, Markus ^b   Guth, Karsten ^b  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BOND WIRE; COMBUSTION ENGINES; COOLANT LOOPS; COOLANT TEMPERATURE; COOLING LOOPS; HIGH POWER DENSITY; HIGH TEMPERATURE; HYBRID ELECTRICAL VEHICLE; IMPROVED RELIABILITY; JUNCTION TEMPERATURES; PACKAGING TECHNOLOGIES; POWER CYCLING; POWER MODULE; TEST POWER; WEAK POINTS; WIRE BONDS;

AUTOMOBILE ELECTRONIC EQUIPMENT; CHIP SCALE PACKAGES; COOLANTS; COOLING; ELECTRIC VEHICLES; POWER ELECTRONICS; WIRE;

ELECTRONIC COOLING;

EID: 79953751298     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. F. Vogel, S. Lutz, A. Hensler, J. Lutz, M. Thoben, W. Schön, A. Munding, J. Lück, Power Electronics in the Powertrain - An Optimum of Integration, Braunschweiger Hybridsymposium, 2009.
2. M. Thoben, D. Siepe, K. Kriegel, Use of Power electronics for HEV at elevated temperature, Braunschweiger Hybridsymposium, 2008.
3. R. Bayerer, T. Herrmann, T. Licht, J. Lutz, M. Feller, Model for Power Cycling lifetime of IGBT Modules - various factors influencing lifetime, CIPS, 2008.
4. R. Amro, J. Lutz, J. Rudzki, R. Sittig, M. Thoben, Power Cycling at High Temperature Swings of Modules with Low Temperature Joining Technique, Proccedings of the ISPSD, Naples, 2006.
5. A. Hensler, J. Lutz, M. Thoben, W. Schön, S. Lutz, A. Munding, J. Lück, Power Electronics for Power Cycling Capability at High Temperatures and High Temperature Swings, Braunschweiger Hybridsymposium, 2009.