Fast extraction of dynamic thermal impedance for multi-chip power modules

2010 6th International Conference on Integrated Power Electronics Systems, CIPS 2010

Volumn , Issue , 2011, Pages

  Evans, Paul ^a   Johnson, C Mark ^a  

^a UNIVERSITY OF NOTTINGHAM   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CURVE-FIT; DOMINANT EIGENVALUES; EIGENVALUES; EXPERIMENTAL DATA; FAST EXTRACTION; FINITE DIFFERENCE; FINITE-ELEMENT; GMRES ALGORITHM; HALF-BRIDGE; MULTI-CHIP; NOVEL METHODS; REDUCED ORDER SYSTEMS; THERMAL IMPEDANCE;

CURVE FITTING; DATA REDUCTION; EIGENVALUES AND EIGENFUNCTIONS; POWER ELECTRONICS;

FINITE ELEMENT METHOD;

EID: 79953732212     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. M. Whitehead and C. M. Johnson, "Determination of Thermal Cross-Coupling Effects in Multi-Device Power Electronic Modules, " inPEMD 2006, The Contarf Castle, Dublin, Ireland, 2006, pp. 261-265.
2. D. Cottet, U. Drofenik, and J.-M. Meyer, "A systematic design approach to thermal-electrical power electronics integration, " in ESTC 2008, Greenwich, UK., 2008, pp. 219-224.
3. U. Drofenik, D. Cottet, A. Musing, J.-M. Meyer, and J. W. Kolar, "Computationally Efficient Integration of Complex Thermal Multi-Chip Power Module Models into Circuit Simulators, " in PCC'07, Nagoya, Japan, 2007, pp. 550-557. (Pubitemid 47468562)
4. A. Dehbi, W. Wondrak, E. B. Rudnyi, U. Killat, and P. van Duijsen, "Efficient electrothermal simulation of power electronics for hybrid electric vehicle, " in EuroSimE 2008., 2008, pp. 1-7.
5. T. Bechtold, E. B. Rudnyi, and J. G. Korvink, Fast Simulation of Electro-Thermal MEMs. Freiburg: Springer, 2006.
6. Y. Saad, Iterative Methods for Sparse Linear Systems. Boston, MA: PWS Publishing Co., 1996.