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Advanced Materials Research

Volumn 197-198, Issue , 2011, Pages 531-535

Electroless plating of silver on microorganism cells

(5) Lan, Ming Ming a Zhang, De Yuan a Cai, Jun a Zhang, Wen Qiang a Li, Hai Yang a

a PEKING UNIVERSITY (China)

Author keywords

Bio limited forming; Dielectric property; Electroless plating; Helical particles; Microorganism cells

Indexed keywords

BIO-LIMITED FORMING; COATING THICKNESS; CONDUCTIVE NETWORKS; DIELECTRIC CONSTANTS; ELECTROLESS; ENERGY DISPERSIVE SPECTROMETERS; HELICAL PARTICLES; PERCOLATION PHENOMENON; SEM; SILVER COATINGS; SPIRULINA; SPIRULINA PLATENSIS; VECTOR NETWORK ANALYZERS;

COATINGS; DIELECTRIC PROPERTIES; ELECTRIC NETWORK ANALYSIS; ELECTRIC NETWORK ANALYZERS; ELECTROLESS PLATING; ELECTRON TUNNELING; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SILVER PLATING; SOLVENTS; THICKNESS MEASUREMENT;

SILVER;

EID: 79952668016 PISSN: 10226680 EISSN: None Source Type: Book Series
DOI: 10.4028/www.scientific.net/AMR.197-198.531 Document Type: Conference Paper

Times cited : (2)

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