Cu-Sn wafer level bonding for vacuum encapsulation of microbolometers focal plane arrays

ECS Transactions

Volumn 33, Issue 4, 2010, Pages 73-82

  Lapadatu, A ^a   Simonsen, T I ^a   Kittilsland, G ^a   Stark, B ^a   Hoivik, N ^b   Dalsrud, V ^b   Salomonsen, Guttorm ^b  

^a Sensonor Technologies AS   (Norway)

^b UNIVERSITY OF SOUTH EASTERN NORWAY   (Norway)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; COPPER COMPOUNDS; SILICON WAFERS; TIN ALLOYS; TIN COMPOUNDS;

CU-SN INTERMETALLICS; INTERDIFFUSION BONDING; INTERFERENCE FRINGE; MICROELECTROMECHANICAL STRUCTURES; TEMPERATURE AND PRESSURES; TEMPERATURE CYCLING; WAFER LEVEL BONDINGS; WAFER LEVEL VACUUM ENCAPSULATION;

WAFER BONDING;

EID: 79952643491     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3483495     Document Type: Conference Paper

References (14)

1. Traeger, R.K., in Proceedings 25th Electronics Components Conference 1976, 361 (1976).
2. L. Bernstein, J. Electrochem. Soc, 113(12), 1282 (1966).
3. H. Huebner, O. Ehrmann, M. Eigner, W. Gruber, A. Klumpp, R. Merkel, P. Ramm, M. Roth, J. Weber, R. Wieland, Advanced Metallization Conference AMC 2002, 18, 53 (2002).
4. R. Schmid-Fetzer, in Design fundamentals of high temperature Composites, Intermetallics, and metal-ceramics systems, R.Y. Lin, Y.A. Chang, R.G. Reddy and C.T. Liu, Editors, p. 75, The minerals, metals & materials society, Warrendale, Pa (1995).
5. A. Munding, H. Hübner, A. Kaiser, S. Penka, P., Benkart, E. Kohn, in Wafer level 3-D ICs processes technology, p. 131, Springer Science + Media Business, LLC, New York (2008).
6. L. Li, J. Jiao. L. Luo, Y. Wang, in Proceedings of The 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Zhuhai, China, p. 1133 (2006).
7. S. Farrens, in Wafer level 3-D ICs processes technology, p 49, Springer Science + Media Business, LLC, New York (2008).
8. W. Lin, Y.C. Lee, IEEE Transactions on advanced packaging, 22(4), 592 (1999).
9. C.C. Lee, Y-C. Chen, Thin Solid Films, 286, 213 (1996).
10. K. Wang, K. Aasmundtveit, H. Jakobsen, in Proceedings of The 2nd Electronics System-Integration Technology Conference (ESTC), Greenwich, UK, p. 1131, (2008).
11. H. Liu, K. Wang, K. Aasmundtveit, N. Hoivik, in Proceedings of ECTC2010, Las Vegas, USA, (2010).
12. N.S. Bosco, F.W. Zok, Acta Materialia, 52, 2965 (2004).
13. N. Hoivik, K. Wang, K. Aasmundtveit, G. Salomonsen, A. Lapadatu, G. Kittilsland, B. Stark, in Proceedings of The 3rd Electronics System-Integration Technology Conference, Berlin, Germany (2010).
14. N. Saunders, A.P. Miodownik, in Binary alloy phase diagrams, T.B. Masalski and others, Editors, p. 1481, ASM International, Metals Park, Ohio (1990).