From simulation to characterization - Integrated approach for Self Aligned Double Patterning defectivity

IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings

Volumn , Issue , 2008, Pages 11-14

  Conley, Amiad ^a   Meshulach, Doron ^a   Gichon, Guy ^a   Dolev, Ido ^a   Perlovitch, Renana ^a   Landwer, Niv ^a   Ngai, Chris ^a   Cai, Man Ping ^a   Miao, Liyan ^a  

^a Applied Materials Inc Israel   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

APPLIED MATERIALS; COMPREHENSIVE STUDIES; CONTROL STRATEGIES; DEFECT TYPE; DEFECTIVITY; DOUBLE PATTERNING; IC MANUFACTURERS; INSPECTION STRATEGY; INTEGRATED APPROACH; LITHOGRAPHY RESOLUTION; SELF-ALIGNED; TECHNOLOGY CENTERS;

DEFECTS; SEMICONDUCTOR DEVICE MANUFACTURE;

MANUFACTURE;

EID: 79952546423     PISSN: 1523553X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)