Compressive flow behavior of Cu thin films and Cu/Nb multilayers containing nanometer-scale helium bubbles

Scripta Materialia

Volumn 64, Issue 10, 2011, Pages 974-977

  Li, N ^a   Mara, N A ^a   Wang, Y Q ^b   Nastasi, M ^a   Misra, A ^a  

^a LOS ALAMOS NATIONAL LABORATORY   (United States)

^b LOS ALAMOS NATIONAL LABORATORY   (United States)

Author keywords

Helium bubbles; Interface; Pillar compression; Radiation induced strengthening

Indexed keywords

CU FILMS; CU THIN FILM; DEFORMABILITY; FLOW BEHAVIORS; FLOW STRENGTH; HELIUM BUBBLES; INTERFACE; LAYER THICKNESS; NANO-METER-SCALE; PILLAR COMPRESSION; RADIATION-INDUCED STRENGTHENING;

COPPER; DEFORMATION; FILM PREPARATION; HARDENING; HELIUM; RADIATION HARDENING; STRENGTHENING (METAL);

MULTILAYERS;

EID: 79952536561     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2011.02.001     Document Type: Article

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