Copper plating for 3D interconnects

Microelectronic Engineering

Volumn 88, Issue 5, 2011, Pages 701-704

  Radisic, A ^a   Luhn O ^a   Philipsen, H G G ^a   El Mekki, Z ^a   Honore, M ^a   Rodet, S ^a   Armini, S ^a   Drijbooms, C ^a   Bender, H ^a   Ruythooren, W ^a  

^a IMEC   (Belgium)

Author keywords

Copper; Cu; Plating; TSV

Indexed keywords

3-D INTERCONNECTS; BATH COMPOSITIONS; CU; SCIENTIFIC LITERATURE; THROUGH SILICON VIAS; TSV;

COPPER PLATING;

COPPER;

EID: 79952489720     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2010.06.030     Document Type: Conference Paper

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