Powder injection moulding PIM of feedstock based on hydrosoluble binder and submicronic powder to manufacture parts having micro-details

Powder Technology

Volumn 208, Issue 2, 2011, Pages 472-479

  Checot Moinard, D ^a   Rigollet, C ^a   Lourdin, P ^a  

^a Mechanical Engineering   (France)

Author keywords

Alumina; Aqueous debinding; Injection moulding; PIM

Indexed keywords

AQUEOUS DEBINDING; INJECTION MOULDING; LOW COSTS; MEDICAL INDUSTRIES; MICRO POWDER INJECTION MOULDING; MICROMETER RANGES; PIM; POWDER INJECTION MOULDING; POWDER TECHNOLOGY; PROCESS STEPS; STRUCTURAL DETAILS; SUBMILLIMETERS; WATERSOLUBLE;

ELECTRONICS INDUSTRY; FEEDSTOCKS; MANUFACTURE; POWDER METALLURGY; SINTERING; WATER INJECTION;

INJECTION MOLDING;

ALUMINUM OXIDE; MACROGOL;

ARTICLE; CHEMICAL PROCEDURES; CHEMICAL STRUCTURE; COMPOSITE MATERIAL; CONTROLLED STUDY; ELECTRONICS INDUSTRY; EXPERIMENTAL STUDY; FEASIBILITY STUDY; MEDICAL TECHNOLOGY; PARTICLE SIZE; POWDER; POWDER INJECTION MOULDING; PROCESS DEVELOPMENT;

EID: 79952448802     PISSN: 00325910     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.powtec.2010.08.045     Document Type: Article

References (22)

1. German R.G., Bose A. Injection molding of metals and ceramics 1997, Metal Powder Industries Federation, Princeton, USA.
2. Whittaker D. Powder Inject Moulding Int. 2007, 1:14-22.
3. Kryachek V.M. Powder Metall. Met. Ceram. 2004, 43:336-348.
4. Japka J.E. Int. J. Powder Metall 1991, 27:107-114.
5. Wei W.C.J., Wu R.Y., Ho S.J. J. Eur. Ceram. Soc. 2000, 20:1301-1310.
6. Rodriguez-Senin E., Herranz G., Heaney D.F., Vrez A., Levenfeld B., Torralba J.M., German R.M., Paris M.A. Eur. Powder Metall. Assoc. 2004, 5:475-480.
7. Karatas C., Kocer A., Unal H.I., Saritas S. J. Mater. Process. Technol. 2004, 15:77-83.
8. German R.M., Wiesner H., Cornwall R.G. Powder injection moulding technologies 1998, State College, USA.
9. Piotter V., Benzler T., Hanemann T. Proceedings of the first international Euspen Conference, Bremen 1999, 494-497.
10. Kukla C.G. Int. J. Form. Processes 2001, 4:253-269.
11. Liu L., Loh N.H., Tor S.B., Khor K.A., Murakoshi Y., Maeda R., Shimizu T. J. Mater. Process. Technol. 2002, 127:165-168.
12. Petzold F. Powder Inject Moulding Int. 2008, 2:37-42.
13. Piotter V., Benzler T., Gietzelt T., Ruprecht R., Hausselt J. Adv. Eng. Mater. 2002, 10:639-642.
14. Gietzelt T., Jacobi O., Piotter V., Ruprecht R., Hausselt J. J. Mater. Sci. 2004, 39:2113-2119.
15. Fu G., Loh N.H., Tor S.B., Murakoshi Y., Maeda R. Mater. Des. 2004, 25:729-733.
16. Hens K.F., German R.M. Adv. Powder. Metall. Part. Mater. 1990, 3:233-246.
17. Park M.S., Kim J.K., Ahn S., Sung H.J. J. Mater. Sci. 2001, 36:5531-5536.
18. Yang W.W., Yang K.Y., Hon M.H. Mater. Chem. Phys. 2002, 78:416-424.
19. Jorge H., Cunha A.M. EuroPM 2007 Proceedings 2007, 2:239-244.
20. Warren J., German R.M. Mod. Dev. Powder Technol. 1988, 18:391-402.
21. Derosa R.L., Trapasso J.A. J. Mater. Sci. 2002, 37:1079-1082.
22. Howard K.E., Lakeman C.D.E., Payne D.A. J. Am. Ceram. Soc. 1990, 73:2543-2546.