Recovery of copper from bio-leaching solutions of waste printed circuit boards waste by ion exchange

Proceedings - 2010 International Conference on Digital Manufacturing and Automation, ICDMA 2010

Volumn 2, Issue , 2010, Pages 138-140

  Zhang, Chenglong ^a   Cai, Yujia ^a   Wang, Jingwei ^a   Bai, Jianfeng ^a   Zhou, Yuan ^a   Wu, Wenjie ^a   Mao, Wenxiong ^b  

^a SHANGHAI SECOND POLYTECHNIC UNIVERSITY   (China)

^b Xiongyue Environment Protection Tech Co Ltd   (China)

Author keywords

Bioleaching; Copper; Ion exchange; Resin; Waste printed circuit boards

Indexed keywords

BED HEIGHT; BIOLEACHING SOLUTION; CHELATING RESIN; COPPER ADSORPTION; EXCHANGE CAPACITIES; IMINODIACETIC ACID; LEACHING SOLUTION; MACROPOROUS; PH VALUE; SULPHURIC ACIDS; WASTE PRINTED CIRCUIT BOARD; WASTE PRINTED CIRCUIT BOARDS;

ADSORPTION; BIOLEACHING; COPPER; ION EXCHANGE; IONS; MANUFACTURE; PRINTED CIRCUIT MANUFACTURE; RECOVERY; RESINS; STYRENE; SULFURIC ACID;

PRINTED CIRCUIT BOARDS;

EID: 79951831001     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICDMA.2010.428     Document Type: Conference Paper

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